→ rdfs:label → "Clean Rooms - Integrated Photonics"^^xsd:string
→ dcterms:description → "The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
→ skos:notation → "F10010"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
→ dc:description → "The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
← is
oo:relatedFacility of
← http://id.southampton.ac.uk/equipment/E10305,
http://id.southampton.ac.uk/equipment/E10316,
http://id.southampton.ac.uk/equipment/E10319,
http://id.southampton.ac.uk/equipment/E10320,
http://id.southampton.ac.uk/equipment/E10321,
http://id.southampton.ac.uk/equipment/E10322,
http://id.southampton.ac.uk/equipment/E10323,
http://id.southampton.ac.uk/equipment/E10324,
http://id.southampton.ac.uk/equipment/E10329,
http://id.southampton.ac.uk/equipment/E10332,
http://id.southampton.ac.uk/equipment/E10348,
http://id.southampton.ac.uk/equipment/E10362,
http://id.southampton.ac.uk/equipment/E10373,
http://id.southampton.ac.uk/equipment/E10387,
http://id.southampton.ac.uk/equipment/E10388,
http://id.southampton.ac.uk/equipment/E10494,
http://id.southampton.ac.uk/equipment/E10840,
http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274
→ skos:notation → "53"^^http://id.southampton.ac.uk/ns/building-code-scheme
→ dcterms:spatial → "POLYGON((-1.39913396019065 50.9372142159638,-1.39907008997395 50.9373032056671,-1.39891522041897 50.937259276929,-1.39890569827696 50.9372705987727,-1.39892932396893 50.9372784674524,-1.39859712697686 50.9377277159088,-1.39838674153732 50.93774396259,-1.3984577982763 50.937687410529,-1.39842294364327 50.9376771643524,-1.39822064304129 50.9376180648148,-1.39809892132029 50.937582514482,-1.39802930188577 50.9375621919069,-1.39799786085083 50.9375543798841,-1.3979582451468 50.9375445865492,-1.39795617902165 50.9375199050719,-1.39795384340191 50.9374888833799,-1.39795249592898 50.9374689004178,-1.39794872300479 50.9374351048503,-1.39794863317326 50.9374339726701,-1.39794486024907 50.9373881759563,-1.39794521957518 50.9373882891745,-1.39807691259583 50.93743340658,-1.39810988076676 50.9374439924643,-1.3983446105505 50.9371126021949,-1.39848726301762 50.9371526816356,-1.39856272150148 50.9370497091047,-1.39867465158588 50.9370818632785,-1.3986993552562 50.9370889960675,-1.39913396019065 50.9372142159638))"^^xsd:string
← is
foaf:depicts of
← https://data.southampton.ac.uk/image-archive/buildings/100/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/1000/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/1600/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/1920/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/200/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/220x220/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/240x260/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/300/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/320x198/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/400/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/480x297/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/50/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/600/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/800/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/800x600/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/raw/53.jpg
← is
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within of
← http://id.southampton.ac.uk/facility/F10010,
http://id.southampton.ac.uk/equipment/E10305,
http://id.southampton.ac.uk/equipment/E10316,
http://id.southampton.ac.uk/equipment/E10319,
http://id.southampton.ac.uk/equipment/E10320,
http://id.southampton.ac.uk/equipment/E10321,
http://id.southampton.ac.uk/equipment/E10322,
http://id.southampton.ac.uk/equipment/E10323,
http://id.southampton.ac.uk/equipment/E10329,
http://id.southampton.ac.uk/equipment/E10332,
http://id.southampton.ac.uk/equipment/E10348,
http://id.southampton.ac.uk/equipment/E10362,
http://id.southampton.ac.uk/equipment/E10373,
http://id.southampton.ac.uk/equipment/E10387,
http://id.southampton.ac.uk/equipment/E10388,
http://id.southampton.ac.uk/equipment/E10494,
http://id.southampton.ac.uk/equipment/E10840,
http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274
→ rdfs:label → "Physical Sciences and Engineering"^^xsd:string
← is
oo:organizationPart of
← http://id.southampton.ac.uk/facility/F10010,
http://id.southampton.ac.uk/equipment/E10305,
http://id.southampton.ac.uk/equipment/E10316,
http://id.southampton.ac.uk/equipment/E10319,
http://id.southampton.ac.uk/equipment/E10320,
http://id.southampton.ac.uk/equipment/E10321,
http://id.southampton.ac.uk/equipment/E10322,
http://id.southampton.ac.uk/equipment/E10323,
http://id.southampton.ac.uk/equipment/E10324,
http://id.southampton.ac.uk/equipment/E10329,
http://id.southampton.ac.uk/equipment/E10332,
http://id.southampton.ac.uk/equipment/E10348,
http://id.southampton.ac.uk/equipment/E10362,
http://id.southampton.ac.uk/equipment/E10373,
http://id.southampton.ac.uk/equipment/E10387,
http://id.southampton.ac.uk/equipment/E10388,
http://id.southampton.ac.uk/equipment/E10494,
http://id.southampton.ac.uk/equipment/E10840,
http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274
→ rdfs:label → "Optoelectronics Research Centre"^^xsd:string
← is
oo:organizationPart of
← http://id.southampton.ac.uk/facility/F10010,
http://id.southampton.ac.uk/equipment/E10305,
http://id.southampton.ac.uk/equipment/E10316,
http://id.southampton.ac.uk/equipment/E10319,
http://id.southampton.ac.uk/equipment/E10320,
http://id.southampton.ac.uk/equipment/E10321,
http://id.southampton.ac.uk/equipment/E10323,
http://id.southampton.ac.uk/equipment/E10324,
http://id.southampton.ac.uk/equipment/E10329,
http://id.southampton.ac.uk/equipment/E10332,
http://id.southampton.ac.uk/equipment/E10348,
http://id.southampton.ac.uk/equipment/E10362,
http://id.southampton.ac.uk/equipment/E10373,
http://id.southampton.ac.uk/equipment/E10387,
http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274
→ rdfs:label → "Auto 500 Electron Beam Deposition System"^^xsd:string
→ dcterms:description → "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
→ skos:notation → "E10305"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
→ dc:description → "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
→ rdfs:label → "600C Environmental Oven"^^xsd:string
→ skos:notation → "E10316"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "P-16+ Stylus Surface Profiler"^^xsd:string
→ dcterms:description → "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
→ skos:notation → "E10319"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
→ dc:description → "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
→ rdfs:label → "KLA Tencor Alpha Step IQ Stylus Profier"^^xsd:string
→ dcterms:description → "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
→ skos:notation → "E10320"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
→ dc:description → "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
→ rdfs:label → "MRF High Temperature Vacuum Furnace"^^xsd:string
→ dcterms:description → "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen."^^xsd:string
→ skos:notation → "E10321"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen."^^xsd:string
→ dc:description → "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen."^^xsd:string
→ rdfs:label → "Plasmalab 80 Plus / Compact Modular Plasma System"^^xsd:string
→ dcterms:description → "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
→ skos:notation → "E10322"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
→ dc:description → "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
→ rdfs:label → "Plasmalab System 400 / Magnetron Sputtering System"^^xsd:string
→ dcterms:description → "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films."^^xsd:string
→ skos:notation → "E10323"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films."^^xsd:string
→ dc:description → "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films."^^xsd:string
→ rdfs:label → "GX Custom FT-IR Spectrometer (obsolete 1718)"^^xsd:string
→ dcterms:description → "The Frontier¿ IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity."^^xsd:string
→ skos:notation → "E10324"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Frontier¿ IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity."^^xsd:string
→ dc:description → "The Frontier¿ IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity."^^xsd:string
→ dcterms:description → "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer"^^xsd:string
→ skos:notation → "E10329"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer"^^xsd:string
→ dc:description → "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer"^^xsd:string
→ rdfs:label → "Ionfab 300 Plus / Load Locked Ion Beam Etch System"^^xsd:string
→ dcterms:description → "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
→ skos:notation → "E10332"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
→ dc:description → "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
→ rdfs:label → "Planar Air Bearing System"^^xsd:string
→ dcterms:description → "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
→ skos:notation → "E10348"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
→ dc:description → "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
→ skos:notation → "E10362"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Three Zone, Bench Top 1700C Tube Furnace"^^xsd:string
→ skos:notation → "E10373"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Nanolink DPN 5000 System"^^xsd:string
→ skos:notation → "E10387"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "ZeMetrics ZeScope Optical Profiling System"^^xsd:string
→ skos:notation → "E10388"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Nano 38 Sputting Machine Lesker Sputter System"^^xsd:string
→ skos:notation → "E10494"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "PVA Tepla 300 Plasma System"^^xsd:string
→ skos:notation → "E10840"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Flame Hydrolysis Deposition Chamber - 1 of 2"^^xsd:string
→ skos:notation → "E11272"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Flame Hydrolysis Deposition Chamber"^^xsd:string
→ rdfs:label → "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
→ skos:notation → "E11273"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
→ dc:description → "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
→ skos:notation → "E11274"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
