→ skos:notation → "53"^^http://id.southampton.ac.uk/ns/building-code-scheme
→ dcterms:spatial → "POLYGON((-1.39913396019065 50.9372142159638,-1.39907008997395 50.9373032056671,-1.39891522041897 50.937259276929,-1.39890569827696 50.9372705987727,-1.39892932396893 50.9372784674524,-1.39859712697686 50.9377277159088,-1.39838674153732 50.93774396259,-1.3984577982763 50.937687410529,-1.39842294364327 50.9376771643524,-1.39822064304129 50.9376180648148,-1.39809892132029 50.937582514482,-1.39802930188577 50.9375621919069,-1.39799786085083 50.9375543798841,-1.3979582451468 50.9375445865492,-1.39795617902165 50.9375199050719,-1.39795384340191 50.9374888833799,-1.39795249592898 50.9374689004178,-1.39794872300479 50.9374351048503,-1.39794863317326 50.9374339726701,-1.39794486024907 50.9373881759563,-1.39794521957518 50.9373882891745,-1.39807691259583 50.93743340658,-1.39810988076676 50.9374439924643,-1.3983446105505 50.9371126021949,-1.39848726301762 50.9371526816356,-1.39856272150148 50.9370497091047,-1.39867465158588 50.9370818632785,-1.3986993552562 50.9370889960675,-1.39913396019065 50.9372142159638))"^^xsd:string
← is
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within of
← http://id.southampton.ac.uk/equipment/E10235,
http://id.southampton.ac.uk/facility/F10014,
http://id.southampton.ac.uk/equipment/E10238,
http://id.southampton.ac.uk/equipment/E10239,
http://id.southampton.ac.uk/equipment/E10240,
http://id.southampton.ac.uk/equipment/E10241,
http://id.southampton.ac.uk/equipment/E10243,
http://id.southampton.ac.uk/equipment/E10244,
http://id.southampton.ac.uk/equipment/E10245,
http://id.southampton.ac.uk/equipment/E10246,
http://id.southampton.ac.uk/equipment/E10248,
http://id.southampton.ac.uk/equipment/E10249,
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http://id.southampton.ac.uk/facility/F10009,
http://id.southampton.ac.uk/equipment/E10251,
http://id.southampton.ac.uk/equipment/E10253,
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http://id.southampton.ac.uk/equipment/E10260,
http://id.southampton.ac.uk/equipment/E10261,
http://id.southampton.ac.uk/equipment/E10263,
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http://id.southampton.ac.uk/equipment/E10274,
http://id.southampton.ac.uk/equipment/E10275,
http://id.southampton.ac.uk/equipment/E10276,
http://id.southampton.ac.uk/equipment/E10277,
http://id.southampton.ac.uk/equipment/E10278,
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http://id.southampton.ac.uk/equipment/E10280,
http://id.southampton.ac.uk/equipment/E10282,
http://id.southampton.ac.uk/equipment/E10283,
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http://id.southampton.ac.uk/equipment/E10287,
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http://id.southampton.ac.uk/equipment/E10289,
http://id.southampton.ac.uk/equipment/E10290,
http://id.southampton.ac.uk/equipment/E10291,
http://id.southampton.ac.uk/equipment/E10292,
http://id.southampton.ac.uk/equipment/E10293,
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http://id.southampton.ac.uk/equipment/E10298,
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http://id.southampton.ac.uk/facility/F10005,
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http://id.southampton.ac.uk/equipment/E10307,
http://id.southampton.ac.uk/equipment/E10308,
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http://id.southampton.ac.uk/facility/F10007,
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http://id.southampton.ac.uk/equipment/E10721,
http://id.southampton.ac.uk/equipment/E10722,
http://id.southampton.ac.uk/equipment/E10738,
http://id.southampton.ac.uk/equipment/E10740,
http://id.southampton.ac.uk/equipment/E10741,
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http://id.southampton.ac.uk/equipment/E10762,
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http://id.southampton.ac.uk/equipment/E10903,
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http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274,
http://id.southampton.ac.uk/facility/F10006,
http://id.southampton.ac.uk/facility/F10008,
http://id.southampton.ac.uk/facility/F10015,
http://id.southampton.ac.uk/room/53-2083,
http://id.southampton.ac.uk/room/53-3023,
http://id.southampton.ac.uk/room/53-4020,
http://id.southampton.ac.uk/room/53-4025,
http://id.southampton.ac.uk/floor/53-2,
http://id.southampton.ac.uk/floor/53-3,
http://id.southampton.ac.uk/floor/53-4,
http://id.southampton.ac.uk/room/53-4033,
http://id.southampton.ac.uk/room/53-3005,
http://id.southampton.ac.uk/room/53-4016,
http://id.southampton.ac.uk/room/53-2070,
http://id.southampton.ac.uk/room/53-4014,
http://id.southampton.ac.uk/room/53-3039,
http://id.southampton.ac.uk/point-of-service/sculpture-erica,
http://id.southampton.ac.uk/point-of-service/shower16,
http://id.southampton.ac.uk/point-of-service/shower17,
http://id.southampton.ac.uk/point-of-service/shower18,
http://id.southampton.ac.uk/equipment/E11381,
http://id.southampton.ac.uk/room/53-2022,
http://id.southampton.ac.uk/room/53-2044
← is
foaf:depicts of
← https://data.southampton.ac.uk/image-archive/buildings/100/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/1000/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/1600/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/1920/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/200/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/220x220/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/240x260/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/300/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/320x198/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/400/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/480x297/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/50/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/600/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/800/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/800x600/53.jpg,
https://data.southampton.ac.uk/image-archive/buildings/raw/53.jpg
→ rdfs:label → "University of Southampton"^^xsd:string
← is
oo:formalOrganization of
← http://id.southampton.ac.uk/building/53,
http://id.southampton.ac.uk/equipment/E10235,
http://id.southampton.ac.uk/facility/F10014,
http://id.southampton.ac.uk/equipment/E10238,
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http://id.southampton.ac.uk/equipment/E10244,
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http://id.southampton.ac.uk/equipment/E10248,
http://id.southampton.ac.uk/equipment/E10249,
http://id.southampton.ac.uk/equipment/E10250,
http://id.southampton.ac.uk/facility/F10009,
http://id.southampton.ac.uk/equipment/E10251,
http://id.southampton.ac.uk/equipment/E10253,
http://id.southampton.ac.uk/equipment/E10258,
http://id.southampton.ac.uk/equipment/E10260,
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http://id.southampton.ac.uk/equipment/E11007,
http://id.southampton.ac.uk/equipment/E11042,
http://id.southampton.ac.uk/equipment/E11043,
http://id.southampton.ac.uk/equipment/E11046,
http://id.southampton.ac.uk/equipment/E11047,
http://id.southampton.ac.uk/equipment/E11067,
http://id.southampton.ac.uk/equipment/E11069,
http://id.southampton.ac.uk/equipment/E11075,
http://id.southampton.ac.uk/equipment/E11165,
http://id.southampton.ac.uk/equipment/E11213,
http://id.southampton.ac.uk/equipment/E11263,
http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274,
http://id.southampton.ac.uk/facility/F10006,
http://id.southampton.ac.uk/facility/F10008
→ rdfs:label → "Comms, Signal Processing & Control"^^xsd:string
→ rdfs:label → "Technical Support Staff"^^xsd:string
→ rdfs:label → "Electronic & Software Systems"^^xsd:string
→ rdfs:label → "Building 53 is non-residential"^^xsd:string
→ rdfs:label → "Salisbury road entrance"^^xsd:string
→ rdfs:comment → "Faculty of Physical Sciences and Engineering Student office"^^xsd:string
→ rdfs:comment → "Card access rather than pushbutton"^^xsd:string
→ dcterms:description → "The Caliber is a versatile and high performance SPM system designed for multifunctional and routine microscopy of surface topology, polymer, biomaterials and semiconductor materials. The compact design and user friendly interface make it a suitable educational tool as well as for research activity."^^xsd:string
→ skos:notation → "E10235"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Caliber is a versatile and high performance SPM system designed for multifunctional and routine microscopy of surface topology, polymer, biomaterials and semiconductor materials. The compact design and user friendly interface make it a suitable educational tool as well as for research activity."^^xsd:string
→ dc:description → "The Caliber is a versatile and high performance SPM system designed for multifunctional and routine microscopy of surface topology, polymer, biomaterials and semiconductor materials. The compact design and user friendly interface make it a suitable educational tool as well as for research activity."^^xsd:string
→ rdfs:label → "Clean Rooms - Nanofabrication"^^xsd:string
→ dcterms:description → "The Southampton Nanofabrication Centre is a state-of-the-art facility for microfabrication and high-spec nanofabrication, as well as a wide range of characterisation capabilities housed in the new Mountbatten Complex at the University of Southampton. One of the premiere cleanrooms in Europe, the Centre has a uniquely broad range of technologies, combining traditional and novel top down fabrication with state-of-the-art bottom up fabrication. This allows us to develop and produce a wide range of devices in diverse fields such as electronics, nanotechnology and bionanotechnology and incorporate them into an equally comprehensive array of nano and microsystems for analysis and use. The characterisation capability is similarly extensive catalogue of microscopes and test gear, from nanometre resolution scanning microscopes to electrical, magnetic and RF analysis. A detailed equiment list can be found at http://www.southampton-nanofab.com/machineDatabase/"^^xsd:string
→ skos:notation → "F10014"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Southampton Nanofabrication Centre is a state-of-the-art facility for microfabrication and high-spec nanofabrication, as well as a wide range of characterisation capabilities housed in the new Mountbatten Complex at the University of Southampton. One of the premiere cleanrooms in Europe, the Centre has a uniquely broad range of technologies, combining traditional and novel top down fabrication with state-of-the-art bottom up fabrication. This allows us to develop and produce a wide range of devices in diverse fields such as electronics, nanotechnology and bionanotechnology and incorporate them into an equally comprehensive array of nano and microsystems for analysis and use. The characterisation capability is similarly extensive catalogue of microscopes and test gear, from nanometre resolution scanning microscopes to electrical, magnetic and RF analysis. A detailed equiment list can be found at http://www.southampton-nanofab.com/machineDatabase/"^^xsd:string
→ dc:description → "The Southampton Nanofabrication Centre is a state-of-the-art facility for microfabrication and high-spec nanofabrication, as well as a wide range of characterisation capabilities housed in the new Mountbatten Complex at the University of Southampton. One of the premiere cleanrooms in Europe, the Centre has a uniquely broad range of technologies, combining traditional and novel top down fabrication with state-of-the-art bottom up fabrication. This allows us to develop and produce a wide range of devices in diverse fields such as electronics, nanotechnology and bionanotechnology and incorporate them into an equally comprehensive array of nano and microsystems for analysis and use. The characterisation capability is similarly extensive catalogue of microscopes and test gear, from nanometre resolution scanning microscopes to electrical, magnetic and RF analysis. A detailed equiment list can be found at http://www.southampton-nanofab.com/machineDatabase/"^^xsd:string
← is
oo:relatedFacility of
← http://id.southampton.ac.uk/equipment/E10235,
http://id.southampton.ac.uk/equipment/E10239,
http://id.southampton.ac.uk/equipment/E10240,
http://id.southampton.ac.uk/equipment/E10241,
http://id.southampton.ac.uk/equipment/E10243,
http://id.southampton.ac.uk/equipment/E10244,
http://id.southampton.ac.uk/equipment/E10245,
http://id.southampton.ac.uk/equipment/E10246,
http://id.southampton.ac.uk/equipment/E10249,
http://id.southampton.ac.uk/equipment/E10251,
http://id.southampton.ac.uk/equipment/E10253,
http://id.southampton.ac.uk/equipment/E10258,
http://id.southampton.ac.uk/equipment/E10260,
http://id.southampton.ac.uk/equipment/E10261,
http://id.southampton.ac.uk/equipment/E10263,
http://id.southampton.ac.uk/equipment/E10264,
http://id.southampton.ac.uk/equipment/E10265,
http://id.southampton.ac.uk/equipment/E10267,
http://id.southampton.ac.uk/equipment/E10268,
http://id.southampton.ac.uk/equipment/E10272,
http://id.southampton.ac.uk/equipment/E10273,
http://id.southampton.ac.uk/equipment/E10274,
http://id.southampton.ac.uk/equipment/E10275,
http://id.southampton.ac.uk/equipment/E10276,
http://id.southampton.ac.uk/equipment/E10277,
http://id.southampton.ac.uk/equipment/E10279,
http://id.southampton.ac.uk/equipment/E10282,
http://id.southampton.ac.uk/equipment/E10283,
http://id.southampton.ac.uk/equipment/E10284,
http://id.southampton.ac.uk/equipment/E10287,
http://id.southampton.ac.uk/equipment/E10288,
http://id.southampton.ac.uk/equipment/E10289,
http://id.southampton.ac.uk/equipment/E10290,
http://id.southampton.ac.uk/equipment/E10291,
http://id.southampton.ac.uk/equipment/E10293,
http://id.southampton.ac.uk/equipment/E10304,
http://id.southampton.ac.uk/equipment/E10307,
http://id.southampton.ac.uk/equipment/E10308,
http://id.southampton.ac.uk/equipment/E10314,
http://id.southampton.ac.uk/equipment/E10330,
http://id.southampton.ac.uk/equipment/E10331,
http://id.southampton.ac.uk/equipment/E10396,
http://id.southampton.ac.uk/equipment/E10398,
http://id.southampton.ac.uk/equipment/E10434,
http://id.southampton.ac.uk/equipment/E10435,
http://id.southampton.ac.uk/equipment/E10436,
http://id.southampton.ac.uk/equipment/E10438,
http://id.southampton.ac.uk/equipment/E10442,
http://id.southampton.ac.uk/equipment/E10443,
http://id.southampton.ac.uk/equipment/E10446,
http://id.southampton.ac.uk/equipment/E10448,
http://id.southampton.ac.uk/equipment/E10449,
http://id.southampton.ac.uk/equipment/E10450,
http://id.southampton.ac.uk/equipment/E10451,
http://id.southampton.ac.uk/equipment/E10452,
http://id.southampton.ac.uk/equipment/E10453,
http://id.southampton.ac.uk/equipment/E10454,
http://id.southampton.ac.uk/equipment/E10455,
http://id.southampton.ac.uk/equipment/E10456,
http://id.southampton.ac.uk/equipment/E10458,
http://id.southampton.ac.uk/equipment/E10459,
http://id.southampton.ac.uk/equipment/E10464,
http://id.southampton.ac.uk/equipment/E10465,
http://id.southampton.ac.uk/equipment/E10466,
http://id.southampton.ac.uk/equipment/E10467,
http://id.southampton.ac.uk/equipment/E10468,
http://id.southampton.ac.uk/equipment/E10469,
http://id.southampton.ac.uk/equipment/E10471,
http://id.southampton.ac.uk/equipment/E10472,
http://id.southampton.ac.uk/equipment/E10473,
http://id.southampton.ac.uk/equipment/E10474,
http://id.southampton.ac.uk/equipment/E10475,
http://id.southampton.ac.uk/equipment/E10476,
http://id.southampton.ac.uk/equipment/E10477,
http://id.southampton.ac.uk/equipment/E10478,
http://id.southampton.ac.uk/equipment/E10488,
http://id.southampton.ac.uk/equipment/E10613,
http://id.southampton.ac.uk/equipment/E10614,
http://id.southampton.ac.uk/equipment/E10615,
http://id.southampton.ac.uk/equipment/E10617,
http://id.southampton.ac.uk/equipment/E10712,
http://id.southampton.ac.uk/equipment/E10758
→ rdfs:label → "Cryoview 2000-Low Temperature"^^xsd:string
→ dcterms:description → "The Nanonics CryoView 2000 is the state-of-the-art low temperature scanning probe microscopy and device characterisation system. To expand its characterisation and analytical capability, the CryoView is integrated to the inVia Raman spectrometer."^^xsd:string
→ skos:notation → "E10238"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Nanonics CryoView 2000 is the state-of-the-art low temperature scanning probe microscopy and device characterisation system. To expand its characterisation and analytical capability, the CryoView is integrated to the inVia Raman spectrometer."^^xsd:string
→ dc:description → "The Nanonics CryoView 2000 is the state-of-the-art low temperature scanning probe microscopy and device characterisation system. To expand its characterisation and analytical capability, the CryoView is integrated to the inVia Raman spectrometer."^^xsd:string
→ rdfs:label → "Opt System 100 Oxide Etcher"^^xsd:string
→ dcterms:description → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP01 RIE80+ system is configured for etching of polysilicon, amorphous silicon, silica, silicon nitride and polymer. 13.56 MHz driven parallel plate reactor Substrate electrode: 170 or 240 mm Shower head gas inlet optimised for RIE High conductance vacuum layout Gases: CHF3, Ar, O2, SF6, CF4, N2"^^xsd:string
→ skos:notation → "E10239"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP01 RIE80+ system is configured for etching of polysilicon, amorphous silicon, silica, silicon nitride and polymer. 13.56 MHz driven parallel plate reactor Substrate electrode: 170 or 240 mm Shower head gas inlet optimised for RIE High conductance vacuum layout Gases: CHF3, Ar, O2, SF6, CF4, N2"^^xsd:string
→ dc:description → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP01 RIE80+ system is configured for etching of polysilicon, amorphous silicon, silica, silicon nitride and polymer. 13.56 MHz driven parallel plate reactor Substrate electrode: 170 or 240 mm Shower head gas inlet optimised for RIE High conductance vacuum layout Gases: CHF3, Ar, O2, SF6, CF4, N2"^^xsd:string
→ rdfs:label → "Opt System 100 Metal Etcher"^^xsd:string
→ dcterms:description → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon."^^xsd:string
→ skos:notation → "E10240"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon."^^xsd:string
→ dc:description → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon."^^xsd:string
→ rdfs:label → "Plasmalab 80 Plus Rie Etcher"^^xsd:string
→ dcterms:description → "The etching plasma is created by an RIE RF source and RF induction magnetic coil to produce high plasma densities. The results are high etch rate, high aspect ratio, and anisotropic etching of material of the samples. The system can also operate in ICP or RIE mode separately. This system is configured for fluorine-based chemistry etching. Ideal for deep oxide etching, silicon nitride, polymer, poly-silicon, amorphous silicon and crystalline silicon."^^xsd:string
→ skos:notation → "E10241"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The etching plasma is created by an RIE RF source and RF induction magnetic coil to produce high plasma densities. The results are high etch rate, high aspect ratio, and anisotropic etching of material of the samples. The system can also operate in ICP or RIE mode separately. This system is configured for fluorine-based chemistry etching. Ideal for deep oxide etching, silicon nitride, polymer, poly-silicon, amorphous silicon and crystalline silicon."^^xsd:string
→ dc:description → "The etching plasma is created by an RIE RF source and RF induction magnetic coil to produce high plasma densities. The results are high etch rate, high aspect ratio, and anisotropic etching of material of the samples. The system can also operate in ICP or RIE mode separately. This system is configured for fluorine-based chemistry etching. Ideal for deep oxide etching, silicon nitride, polymer, poly-silicon, amorphous silicon and crystalline silicon."^^xsd:string
→ dcterms:description → "Ionfab300Plus is a modular System designed for ion beam etching. It is used in a wide variety of processes, particularly in the Semiconductor and Optical Coating Industries."^^xsd:string
→ skos:notation → "E10243"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Ionfab300Plus is a modular System designed for ion beam etching. It is used in a wide variety of processes, particularly in the Semiconductor and Optical Coating Industries."^^xsd:string
→ dc:description → "Ionfab300Plus is a modular System designed for ion beam etching. It is used in a wide variety of processes, particularly in the Semiconductor and Optical Coating Industries."^^xsd:string
→ rdfs:label → "EVG620 Top Side Mask Aligner"^^xsd:string
→ dcterms:description → "The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm. Exposure can be performed in hard, soft and proximity modes."^^xsd:string
→ skos:notation → "E10244"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm. Exposure can be performed in hard, soft and proximity modes."^^xsd:string
→ dc:description → "The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm. Exposure can be performed in hard, soft and proximity modes."^^xsd:string
→ rdfs:label → "EVG620 Double Side Mask Aligner"^^xsd:string
→ dcterms:description → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput."^^xsd:string
→ skos:notation → "E10245"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput."^^xsd:string
→ dc:description → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput."^^xsd:string
→ rdfs:label → "Evg620 Double Side Mask Aligner"^^xsd:string
→ dcterms:description → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput."^^xsd:string
→ skos:notation → "E10246"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput."^^xsd:string
→ dc:description → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput."^^xsd:string
→ dcterms:description → "Dynamic light scattering system for the determination of the size and zeta potential of suspended nanoparticles in solution."^^xsd:string
→ skos:notation → "E10248"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Dynamic light scattering system for the determination of the size and zeta potential of suspended nanoparticles in solution."^^xsd:string
→ dc:description → "Dynamic light scattering system for the determination of the size and zeta potential of suspended nanoparticles in solution."^^xsd:string
→ dcterms:description → "The focussed ion beam (FIB) is a multi nanofabrication tool system capable of performing sophisticated nanomachining, in-situ metal or insulator deposition, lithography and metrology analysis. This versatile system is based on the dual ion and electron beams column concept, which allows it to perform ionic nanofabrication function while imaging using the scanning electron microscope. The liquid metal ion source (LMIS) for the system is gallium and it is integrated to an ionisation tungsten tip to produce a fine and high resolution ion beam. The additional features in the FIB are ion and electron beam induced deposition using gaseous metal-insulator sources."^^xsd:string
→ skos:notation → "E10249"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The focussed ion beam (FIB) is a multi nanofabrication tool system capable of performing sophisticated nanomachining, in-situ metal or insulator deposition, lithography and metrology analysis. This versatile system is based on the dual ion and electron beams column concept, which allows it to perform ionic nanofabrication function while imaging using the scanning electron microscope. The liquid metal ion source (LMIS) for the system is gallium and it is integrated to an ionisation tungsten tip to produce a fine and high resolution ion beam. The additional features in the FIB are ion and electron beam induced deposition using gaseous metal-insulator sources."^^xsd:string
→ dc:description → "The focussed ion beam (FIB) is a multi nanofabrication tool system capable of performing sophisticated nanomachining, in-situ metal or insulator deposition, lithography and metrology analysis. This versatile system is based on the dual ion and electron beams column concept, which allows it to perform ionic nanofabrication function while imaging using the scanning electron microscope. The liquid metal ion source (LMIS) for the system is gallium and it is integrated to an ionisation tungsten tip to produce a fine and high resolution ion beam. The additional features in the FIB are ion and electron beam induced deposition using gaseous metal-insulator sources."^^xsd:string
→ dcterms:description → "Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of carbon nanotubes (CNTs) and Si, SiGe and Ge nanowires. CNT growth temperatures are typically between 600 and 800C. Aligned growth of CNTs can be achieved with a growth rate up to 40 nm/min and random growth can be achieved with growth rates up to hundreds of nm/min. CNT diameters are typically less than 100nm, but depend on catalyst particle size. Silicon nanowires typically require silane for growth at temperatures of 330 - 650C, and vertical growth rates up to 150nm/min can be achieved. Germanium nanowires typically require germane for growth. SiGe nanowires can be grown by mixing silane and germane Heterojunctions can be created in the SiGe nanowires by appropriate control of the flows. All nanowires can be doped p or n type with the addition of diborane or phosphine to a process"^^xsd:string
→ skos:notation → "E10250"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of carbon nanotubes (CNTs) and Si, SiGe and Ge nanowires. CNT growth temperatures are typically between 600 and 800C. Aligned growth of CNTs can be achieved with a growth rate up to 40 nm/min and random growth can be achieved with growth rates up to hundreds of nm/min. CNT diameters are typically less than 100nm, but depend on catalyst particle size. Silicon nanowires typically require silane for growth at temperatures of 330 - 650C, and vertical growth rates up to 150nm/min can be achieved. Germanium nanowires typically require germane for growth. SiGe nanowires can be grown by mixing silane and germane Heterojunctions can be created in the SiGe nanowires by appropriate control of the flows. All nanowires can be doped p or n type with the addition of diborane or phosphine to a process"^^xsd:string
→ dc:description → "Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of carbon nanotubes (CNTs) and Si, SiGe and Ge nanowires. CNT growth temperatures are typically between 600 and 800C. Aligned growth of CNTs can be achieved with a growth rate up to 40 nm/min and random growth can be achieved with growth rates up to hundreds of nm/min. CNT diameters are typically less than 100nm, but depend on catalyst particle size. Silicon nanowires typically require silane for growth at temperatures of 330 - 650C, and vertical growth rates up to 150nm/min can be achieved. Germanium nanowires typically require germane for growth. SiGe nanowires can be grown by mixing silane and germane Heterojunctions can be created in the SiGe nanowires by appropriate control of the flows. All nanowires can be doped p or n type with the addition of diborane or phosphine to a process"^^xsd:string
→ dcterms:description → "The ORC at Southampton has a state-of-the-art Flame Hydrolysis Deposition tool for growth of silica-on-silicon waveguide structures. The system allows the incorporation of germanium, phosphorous and boron doping within the silica, and is particularly optimised for high photosensitivity layer growth. The tool can grow films ranging from 2 microns to 20 microns in thickness."^^xsd:string
→ skos:notation → "F10009"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The ORC at Southampton has a state-of-the-art Flame Hydrolysis Deposition tool for growth of silica-on-silicon waveguide structures. The system allows the incorporation of germanium, phosphorous and boron doping within the silica, and is particularly optimised for high photosensitivity layer growth. The tool can grow films ranging from 2 microns to 20 microns in thickness."^^xsd:string
→ dc:description → "The ORC at Southampton has a state-of-the-art Flame Hydrolysis Deposition tool for growth of silica-on-silicon waveguide structures. The system allows the incorporation of germanium, phosphorous and boron doping within the silica, and is particularly optimised for high photosensitivity layer growth. The tool can grow films ranging from 2 microns to 20 microns in thickness."^^xsd:string
→ rdfs:label → "Atomic layer deposition system"^^xsd:string
→ dcterms:description → "The FlexAl system allows the deposition of ultra-thin layers (typically a few nm) of a variety of metal oxides and nitrides from liquid precursors. The deposition process works by providing a short pulse of precursor, followed by purge and exhaust steps. This cycle is then repeated to build up a layer. Typical growth rates are around 1A/cycle. The system is currently configured for the deposition of ZnO and Al2O3. ZnO is deposited using a DEZ precursor. The deposition rate is typically 1A/cycle at 150C. The refractive index of ALD ZnO varies from 1.75 at low temperature to 1.83 at high temperaure, compared with 1.985 for bulk ZnO. Annealing at 425C (not optimised) can help improve electrical properties."^^xsd:string
→ skos:notation → "E10251"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The FlexAl system allows the deposition of ultra-thin layers (typically a few nm) of a variety of metal oxides and nitrides from liquid precursors. The deposition process works by providing a short pulse of precursor, followed by purge and exhaust steps. This cycle is then repeated to build up a layer. Typical growth rates are around 1A/cycle. The system is currently configured for the deposition of ZnO and Al2O3. ZnO is deposited using a DEZ precursor. The deposition rate is typically 1A/cycle at 150C. The refractive index of ALD ZnO varies from 1.75 at low temperature to 1.83 at high temperaure, compared with 1.985 for bulk ZnO. Annealing at 425C (not optimised) can help improve electrical properties."^^xsd:string
→ dc:description → "The FlexAl system allows the deposition of ultra-thin layers (typically a few nm) of a variety of metal oxides and nitrides from liquid precursors. The deposition process works by providing a short pulse of precursor, followed by purge and exhaust steps. This cycle is then repeated to build up a layer. Typical growth rates are around 1A/cycle. The system is currently configured for the deposition of ZnO and Al2O3. ZnO is deposited using a DEZ precursor. The deposition rate is typically 1A/cycle at 150C. The refractive index of ALD ZnO varies from 1.75 at low temperature to 1.83 at high temperaure, compared with 1.985 for bulk ZnO. Annealing at 425C (not optimised) can help improve electrical properties."^^xsd:string
→ dcterms:description → "Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of amorphous and polycrystalline Si, SiGe and Ge layers. The layers can be doped during growth either n-type (using PH3) or p-type (using B2H6), thereby allowing p-n junctions to be formed. Amorphous silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically 250C, giving a growth rate of around 25 nm/min. Stress in the deposited layer is typically <200Mpa. Polycrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically >=610C. The growth rate at 610C is ~2 nm/min and at 650C ~ 20nm/min. Microcrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically in the range 585 - 610C, giving growth rates in the range 1 - 2 nm/min. Amorphous and polycrystalline germanium use GeH4 as a source of Ge and CF4 & O2 for cleaning."^^xsd:string
→ skos:notation → "E10253"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of amorphous and polycrystalline Si, SiGe and Ge layers. The layers can be doped during growth either n-type (using PH3) or p-type (using B2H6), thereby allowing p-n junctions to be formed. Amorphous silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically 250C, giving a growth rate of around 25 nm/min. Stress in the deposited layer is typically <200Mpa. Polycrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically >=610C. The growth rate at 610C is ~2 nm/min and at 650C ~ 20nm/min. Microcrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically in the range 585 - 610C, giving growth rates in the range 1 - 2 nm/min. Amorphous and polycrystalline germanium use GeH4 as a source of Ge and CF4 & O2 for cleaning."^^xsd:string
→ dc:description → "Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of amorphous and polycrystalline Si, SiGe and Ge layers. The layers can be doped during growth either n-type (using PH3) or p-type (using B2H6), thereby allowing p-n junctions to be formed. Amorphous silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically 250C, giving a growth rate of around 25 nm/min. Stress in the deposited layer is typically <200Mpa. Polycrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically >=610C. The growth rate at 610C is ~2 nm/min and at 650C ~ 20nm/min. Microcrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically in the range 585 - 610C, giving growth rates in the range 1 - 2 nm/min. Amorphous and polycrystalline germanium use GeH4 as a source of Ge and CF4 & O2 for cleaning."^^xsd:string
→ rdfs:label → "He Ion Microscope: Orion-Bu"^^xsd:string
→ dcterms:description → "The Zeiss Orion helium ion microscope has similar functionality to an electron microscope, but uses a focussed beam of helium ions in place of the electrons. The larger mass and therefore smaller de Broglie wavelength of helium ions compared to electrons means that the scanning helium ions microscope suffers less from diffraction effects than a scanning electron microscope (SEM). Since helium ions can be focused into a smaller probe size and provide a much smaller sample interaction compared to electrons, the Orion generates higher resolution images with better material contrast and 5 times improved depth of focus. The high resolution arises from the use of a finely sharpened needle and a process that strips individual atoms away from the source until an atomic pyramid is created with just three atoms at the very end of the source tip. The Orion achieves a resolution of less than 0.9nm at an energy of 25-30kV and can deliver beam currents between 1fA and 25pA."^^xsd:string
→ skos:notation → "E10258"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Zeiss Orion helium ion microscope has similar functionality to an electron microscope, but uses a focussed beam of helium ions in place of the electrons. The larger mass and therefore smaller de Broglie wavelength of helium ions compared to electrons means that the scanning helium ions microscope suffers less from diffraction effects than a scanning electron microscope (SEM). Since helium ions can be focused into a smaller probe size and provide a much smaller sample interaction compared to electrons, the Orion generates higher resolution images with better material contrast and 5 times improved depth of focus. The high resolution arises from the use of a finely sharpened needle and a process that strips individual atoms away from the source until an atomic pyramid is created with just three atoms at the very end of the source tip. The Orion achieves a resolution of less than 0.9nm at an energy of 25-30kV and can deliver beam currents between 1fA and 25pA."^^xsd:string
→ dc:description → "The Zeiss Orion helium ion microscope has similar functionality to an electron microscope, but uses a focussed beam of helium ions in place of the electrons. The larger mass and therefore smaller de Broglie wavelength of helium ions compared to electrons means that the scanning helium ions microscope suffers less from diffraction effects than a scanning electron microscope (SEM). Since helium ions can be focused into a smaller probe size and provide a much smaller sample interaction compared to electrons, the Orion generates higher resolution images with better material contrast and 5 times improved depth of focus. The high resolution arises from the use of a finely sharpened needle and a process that strips individual atoms away from the source until an atomic pyramid is created with just three atoms at the very end of the source tip. The Orion achieves a resolution of less than 0.9nm at an energy of 25-30kV and can deliver beam currents between 1fA and 25pA."^^xsd:string
→ rdfs:label → "Helios Sputtering System Type Xl 6""^^xsd:string
→ dcterms:description → "The HELIOS sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. It specializes in high quality optical coatings featuring very low absorption and scattering. Optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Precision in layer growth control is facilitated by an optical monitoring system for in-situ on-substrate measurements."^^xsd:string
→ skos:notation → "E10260"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The HELIOS sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. It specializes in high quality optical coatings featuring very low absorption and scattering. Optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Precision in layer growth control is facilitated by an optical monitoring system for in-situ on-substrate measurements."^^xsd:string
→ dc:description → "The HELIOS sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. It specializes in high quality optical coatings featuring very low absorption and scattering. Optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Precision in layer growth control is facilitated by an optical monitoring system for in-situ on-substrate measurements."^^xsd:string
→ rdfs:label → "Field Emmission Scanning Electron Microscope (FEG-SEM)"^^xsd:string
→ dcterms:description → "High resolution FEG-SEM for sub 100nm imaging. Magnification x100 to x1000000"^^xsd:string
→ skos:notation → "E10261"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "High resolution FEG-SEM for sub 100nm imaging. Magnification x100 to x1000000"^^xsd:string
→ dc:description → "High resolution FEG-SEM for sub 100nm imaging. Magnification x100 to x1000000"^^xsd:string
→ dcterms:description → " LAB700 e-gun evaporator incorporates 2e-guns each with a 5xcrucible plate. is configured for reactive ion assisted deposition of dielectrics, high precision lift off, variable angle deposition, cryogenic deposition"^^xsd:string
→ skos:notation → "E10263"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → " LAB700 e-gun evaporator incorporates 2e-guns each with a 5xcrucible plate. is configured for reactive ion assisted deposition of dielectrics, high precision lift off, variable angle deposition, cryogenic deposition"^^xsd:string
→ dc:description → " LAB700 e-gun evaporator incorporates 2e-guns each with a 5xcrucible plate. is configured for reactive ion assisted deposition of dielectrics, high precision lift off, variable angle deposition, cryogenic deposition"^^xsd:string
→ dcterms:description → "X-ray fluorescence (XRF) analysis of glasses & high sensitivity trace analysis, spatial resolution 50um, sensitivity element dependant, down to 50ppm"^^xsd:string
→ skos:notation → "E10264"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "X-ray fluorescence (XRF) analysis of glasses & high sensitivity trace analysis, spatial resolution 50um, sensitivity element dependant, down to 50ppm"^^xsd:string
→ dc:description → "X-ray fluorescence (XRF) analysis of glasses & high sensitivity trace analysis, spatial resolution 50um, sensitivity element dependant, down to 50ppm"^^xsd:string
→ dcterms:description → "Sub 100nm spatial resolution imagaing of distribution elements in a sample. Spatial location of lements in an alloy, imaging of contacts under metal, semiconductor metal failure analysis, analysis of layered structures."^^xsd:string
→ skos:notation → "E10265"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Sub 100nm spatial resolution imagaing of distribution elements in a sample. Spatial location of lements in an alloy, imaging of contacts under metal, semiconductor metal failure analysis, analysis of layered structures."^^xsd:string
→ dc:description → "Sub 100nm spatial resolution imagaing of distribution elements in a sample. Spatial location of lements in an alloy, imaging of contacts under metal, semiconductor metal failure analysis, analysis of layered structures."^^xsd:string
→ rdfs:label → "Auto 306 Resistance Evaporation System"^^xsd:string
→ dcterms:description → "Resistance evaporation source for filament or boat evaporation. A built-in shield prevents unwanted coating of the vacuum chamber and adjacent deposition accessories. Four position turret evaporation source capable of sequentially depositing up to 4 different materials without breaking vacuum. Sources are selected and rotated into the evaporation position using a simple handwheel control. The sources can be configured to evaporate from the center or the side of the vacuum chamber for optimum film thickness uniformity onto a choice of static or rotating substrate fixtures."^^xsd:string
→ skos:notation → "E10267"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Resistance evaporation source for filament or boat evaporation. A built-in shield prevents unwanted coating of the vacuum chamber and adjacent deposition accessories. Four position turret evaporation source capable of sequentially depositing up to 4 different materials without breaking vacuum. Sources are selected and rotated into the evaporation position using a simple handwheel control. The sources can be configured to evaporate from the center or the side of the vacuum chamber for optimum film thickness uniformity onto a choice of static or rotating substrate fixtures."^^xsd:string
→ dc:description → "Resistance evaporation source for filament or boat evaporation. A built-in shield prevents unwanted coating of the vacuum chamber and adjacent deposition accessories. Four position turret evaporation source capable of sequentially depositing up to 4 different materials without breaking vacuum. Sources are selected and rotated into the evaporation position using a simple handwheel control. The sources can be configured to evaporate from the center or the side of the vacuum chamber for optimum film thickness uniformity onto a choice of static or rotating substrate fixtures."^^xsd:string
→ dcterms:description → "Cleaner/lift-off/stripper module/developer module. 4,6,8 inch wafers, 5.6.7 inch plates."^^xsd:string
→ skos:notation → "E10268"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Cleaner/lift-off/stripper module/developer module. 4,6,8 inch wafers, 5.6.7 inch plates."^^xsd:string
→ dc:description → "Cleaner/lift-off/stripper module/developer module. 4,6,8 inch wafers, 5.6.7 inch plates."^^xsd:string
→ rdfs:label → "Nikon L200D microscope"^^xsd:string
→ dcterms:description → "Upright 8" yellow room microscope, 5M camera, 5x to 150x objectives, Nomarski"^^xsd:string
→ skos:notation → "E10272"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Upright 8" yellow room microscope, 5M camera, 5x to 150x objectives, Nomarski"^^xsd:string
→ dc:description → "Upright 8" yellow room microscope, 5M camera, 5x to 150x objectives, Nomarski"^^xsd:string
→ rdfs:label → "Nikon LV100D Bioelectronics microscope"^^xsd:string
→ dcterms:description → "Upright 6" bioMEMS microscope, 5m camera, display & software, 5x to 150x objectives, Nomarski"^^xsd:string
→ skos:notation → "E10273"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Upright 6" bioMEMS microscope, 5m camera, display & software, 5x to 150x objectives, Nomarski"^^xsd:string
→ dc:description → "Upright 6" bioMEMS microscope, 5m camera, display & software, 5x to 150x objectives, Nomarski"^^xsd:string
→ rdfs:label → "DC Device Multi Probe Station"^^xsd:string
→ dcterms:description → "Cascade Microtech prober, 4 x DCM 210 positioners, Agilent 4155C Semiconductor Parameter Analyser, Agilent 4279A 1MHz CV meter, Agilent E4443A sHz-6.7GHz spectrum analyser, Agilent MXG N5181A analog signal generator 250 KHz-1 GHz"^^xsd:string
→ skos:notation → "E10274"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Cascade Microtech prober, 4 x DCM 210 positioners, Agilent 4155C Semiconductor Parameter Analyser, Agilent 4279A 1MHz CV meter, Agilent E4443A sHz-6.7GHz spectrum analyser, Agilent MXG N5181A analog signal generator 250 KHz-1 GHz"^^xsd:string
→ dc:description → "Cascade Microtech prober, 4 x DCM 210 positioners, Agilent 4155C Semiconductor Parameter Analyser, Agilent 4279A 1MHz CV meter, Agilent E4443A sHz-6.7GHz spectrum analyser, Agilent MXG N5181A analog signal generator 250 KHz-1 GHz"^^xsd:string
→ rdfs:label → "Summit 12000B-Ap Probe Station Platform"^^xsd:string
→ dcterms:description → "Semi-automatic 200mm probe station with micro-chamber, temperature control -65-200C. 4x67GHz infinity probes, eVue digital imaging system"^^xsd:string
→ skos:notation → "E10275"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Semi-automatic 200mm probe station with micro-chamber, temperature control -65-200C. 4x67GHz infinity probes, eVue digital imaging system"^^xsd:string
→ dc:description → "Semi-automatic 200mm probe station with micro-chamber, temperature control -65-200C. 4x67GHz infinity probes, eVue digital imaging system"^^xsd:string
→ rdfs:label → "Theta probe PARXPS system"^^xsd:string
→ dcterms:description → "Parallel angle-resolved XPS (PARXPS) analysis without sample tilting, ability to collect angle-resolved XPS spectra over a 60 degree angular range, in parallel, without tilting the sample and allows the instrument to characterise ultra-thin films non-destructively, allows composition depth profiling using an integrated etching module, X-ray monochrmator with user-selectable spot size in the range 15um to 400um,. Ability to handle large or multiple samples, CCD sample alignment microscope perpendicular to the sample surface."^^xsd:string
→ skos:notation → "E10276"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Parallel angle-resolved XPS (PARXPS) analysis without sample tilting, ability to collect angle-resolved XPS spectra over a 60 degree angular range, in parallel, without tilting the sample and allows the instrument to characterise ultra-thin films non-destructively, allows composition depth profiling using an integrated etching module, X-ray monochrmator with user-selectable spot size in the range 15um to 400um,. Ability to handle large or multiple samples, CCD sample alignment microscope perpendicular to the sample surface."^^xsd:string
→ dc:description → "Parallel angle-resolved XPS (PARXPS) analysis without sample tilting, ability to collect angle-resolved XPS spectra over a 60 degree angular range, in parallel, without tilting the sample and allows the instrument to characterise ultra-thin films non-destructively, allows composition depth profiling using an integrated etching module, X-ray monochrmator with user-selectable spot size in the range 15um to 400um,. Ability to handle large or multiple samples, CCD sample alignment microscope perpendicular to the sample surface."^^xsd:string
→ rdfs:label → "Polytec MSA-400 Micro System Analyzer"^^xsd:string
→ dcterms:description → "3D MEMS dynamics and topography tester. Scanning laser vibrometry for out of plane vibrations up to 20MHz, stroboscopic video microscopy for in-plane motion & vibrations, white light interferometry for surface topography␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣http://data.southampton.ac.uk/equipment/E10277.html"^^xsd:string
→ skos:notation → "E10277"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "3D MEMS dynamics and topography tester. Scanning laser vibrometry for out of plane vibrations up to 20MHz, stroboscopic video microscopy for in-plane motion & vibrations, white light interferometry for surface topography␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣http://data.southampton.ac.uk/equipment/E10277.html"^^xsd:string
→ dc:description → "3D MEMS dynamics and topography tester. Scanning laser vibrometry for out of plane vibrations up to 20MHz, stroboscopic video microscopy for in-plane motion & vibrations, white light interferometry for surface topography␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣␣http://data.southampton.ac.uk/equipment/E10277.html"^^xsd:string
→ rdfs:label → "12 Tesla Cryogen Free Magnet System (Q6003A)"^^xsd:string
→ dcterms:description → "12 Tesla cryogen-free magnet system with 25mm integrated VTI pulse tube cooler, 1.6K - 325k sample space of 25mm diameter, cooldown <24 hours, 300 degree sample rotation"^^xsd:string
→ skos:notation → "E10278"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "12 Tesla cryogen-free magnet system with 25mm integrated VTI pulse tube cooler, 1.6K - 325k sample space of 25mm diameter, cooldown <24 hours, 300 degree sample rotation"^^xsd:string
→ dc:description → "12 Tesla cryogen-free magnet system with 25mm integrated VTI pulse tube cooler, 1.6K - 325k sample space of 25mm diameter, cooldown <24 hours, 300 degree sample rotation"^^xsd:string
→ rdfs:label → "Cascade Microtech M150 Mulitpurpose Probing System"^^xsd:string
→ dcterms:description → "150mm manual probe station, 6 probes, Leica S6 stereo zoom microscope, 0.6-4xzoom, 30 x eyepieces"^^xsd:string
→ skos:notation → "E10279"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "150mm manual probe station, 6 probes, Leica S6 stereo zoom microscope, 0.6-4xzoom, 30 x eyepieces"^^xsd:string
→ dc:description → "150mm manual probe station, 6 probes, Leica S6 stereo zoom microscope, 0.6-4xzoom, 30 x eyepieces"^^xsd:string
→ rdfs:label → "ENA Series Network Analyzer"^^xsd:string
→ skos:notation → "E10280"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "10MHz-67GHz. For use with Cascade probe station."^^xsd:string
→ dc:description → "10MHz-67GHz. For use with Cascade probe station."^^xsd:string
→ rdfs:label → "Jetfirst 200 Rta / Jetfirst 200 Rta No Pump"^^xsd:string
→ dcterms:description → "150mm wafers, temepratures from 400-1000/1200C (pyrometer), 400-1000C (thermocouple), times from 5s to 10mins, temperature accuracy +5c, temperature reproducibility"^^xsd:string
→ skos:notation → "E10282"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "150mm wafers, temepratures from 400-1000/1200C (pyrometer), 400-1000C (thermocouple), times from 5s to 10mins, temperature accuracy +5c, temperature reproducibility"^^xsd:string
→ dc:description → "150mm wafers, temepratures from 400-1000/1200C (pyrometer), 400-1000C (thermocouple), times from 5s to 10mins, temperature accuracy +5c, temperature reproducibility"^^xsd:string
→ dcterms:description → "150mm wafers, manual loading, general furnace, temperature accuracy +/- 1C, 25 wafer boats."^^xsd:string
→ skos:notation → "E10283"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "150mm wafers, manual loading, general furnace, temperature accuracy +/- 1C, 25 wafer boats."^^xsd:string
→ dc:description → "150mm wafers, manual loading, general furnace, temperature accuracy +/- 1C, 25 wafer boats."^^xsd:string
→ rdfs:label → "Tempress Clean Furnace Stack"^^xsd:string
→ dcterms:description → "150mm wafers, automated loading, dru oxidation 600-1150C, wet oxidation 600-1150C, anneal 600-1150C, temperature accuracy +/- 1C, 25 wafer boats."^^xsd:string
→ skos:notation → "E10284"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "150mm wafers, automated loading, dru oxidation 600-1150C, wet oxidation 600-1150C, anneal 600-1150C, temperature accuracy +/- 1C, 25 wafer boats."^^xsd:string
→ dc:description → "150mm wafers, automated loading, dru oxidation 600-1150C, wet oxidation 600-1150C, anneal 600-1150C, temperature accuracy +/- 1C, 25 wafer boats."^^xsd:string
→ rdfs:label → "5430 Fine Wire Bonder SN 30280"^^xsd:string
→ dcterms:description → "Ultrasonic wedge bonder, AI and Au wires (25um), minimum bond pads 50x50um2, bare silicon bonding, programmable individual bonding parameters."^^xsd:string
→ skos:notation → "E10287"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Ultrasonic wedge bonder, AI and Au wires (25um), minimum bond pads 50x50um2, bare silicon bonding, programmable individual bonding parameters."^^xsd:string
→ dc:description → "Ultrasonic wedge bonder, AI and Au wires (25um), minimum bond pads 50x50um2, bare silicon bonding, programmable individual bonding parameters."^^xsd:string
→ dcterms:description → "Scribing of Si, glass & brittle materials. Scribing of glass in all directions with auto alignment function, handles up 300mm substrates with a thickness up to 2mm."^^xsd:string
→ skos:notation → "E10288"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Scribing of Si, glass & brittle materials. Scribing of glass in all directions with auto alignment function, handles up 300mm substrates with a thickness up to 2mm."^^xsd:string
→ dc:description → "Scribing of Si, glass & brittle materials. Scribing of glass in all directions with auto alignment function, handles up 300mm substrates with a thickness up to 2mm."^^xsd:string
→ dcterms:description → "Wafer scribing tool, Vanadium Fibre Laser (1064nm wavelength, 0.25mJ pulse energy, 25um spot size), up to 5000 mm/s scanning speed, programmable z-axis, 245 lens upgrade allowing 220mm diameter field size, vision system for lase focusiing"^^xsd:string
→ skos:notation → "E10289"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Wafer scribing tool, Vanadium Fibre Laser (1064nm wavelength, 0.25mJ pulse energy, 25um spot size), up to 5000 mm/s scanning speed, programmable z-axis, 245 lens upgrade allowing 220mm diameter field size, vision system for lase focusiing"^^xsd:string
→ dc:description → "Wafer scribing tool, Vanadium Fibre Laser (1064nm wavelength, 0.25mJ pulse energy, 25um spot size), up to 5000 mm/s scanning speed, programmable z-axis, 245 lens upgrade allowing 220mm diameter field size, vision system for lase focusiing"^^xsd:string
→ rdfs:label → "Woollam Md2000D Ellipsometer"^^xsd:string
→ dcterms:description → "Spectral range 190nm-1999nm, 200mm computer controlled sample positioning, auto angle of incidence"^^xsd:string
→ skos:notation → "E10290"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Spectral range 190nm-1999nm, 200mm computer controlled sample positioning, auto angle of incidence"^^xsd:string
→ dc:description → "Spectral range 190nm-1999nm, 200mm computer controlled sample positioning, auto angle of incidence"^^xsd:string
→ dcterms:description → "Measures roughness, waviness, step height and wafer stress, 2D and 3D fully autiomated data scans, sequencing capable, up to 8" substrates, vertical features from 100A-300um with a vertical resolution down to 0.5A."^^xsd:string
→ skos:notation → "E10291"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Measures roughness, waviness, step height and wafer stress, 2D and 3D fully autiomated data scans, sequencing capable, up to 8" substrates, vertical features from 100A-300um with a vertical resolution down to 0.5A."^^xsd:string
→ dc:description → "Measures roughness, waviness, step height and wafer stress, 2D and 3D fully autiomated data scans, sequencing capable, up to 8" substrates, vertical features from 100A-300um with a vertical resolution down to 0.5A."^^xsd:string
→ rdfs:label → "Ambios Xp100 Stylus Surface Profiler"^^xsd:string
→ dcterms:description → "Vertical range to 400um, zoom optics 88-247x, 5um stylus, 10mm max scan length, manual X-Y stage."^^xsd:string
→ skos:notation → "E10292"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Vertical range to 400um, zoom optics 88-247x, 5um stylus, 10mm max scan length, manual X-Y stage."^^xsd:string
→ dc:description → "Vertical range to 400um, zoom optics 88-247x, 5um stylus, 10mm max scan length, manual X-Y stage."^^xsd:string
→ dcterms:description → "Particle measurement tool, 150mm substrates, sub micron particles down to 0.2um, measurement time 30 sec on 6" wafers, particles sensitivity 0.2um diameter latex spheres, haze sensitivity 0.4ppm, spatial resolution 50um spacing minimum, measurement range 0.004um and 102um in twelve ranges and 256 gradations."^^xsd:string
→ skos:notation → "E10293"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Particle measurement tool, 150mm substrates, sub micron particles down to 0.2um, measurement time 30 sec on 6" wafers, particles sensitivity 0.2um diameter latex spheres, haze sensitivity 0.4ppm, spatial resolution 50um spacing minimum, measurement range 0.004um and 102um in twelve ranges and 256 gradations."^^xsd:string
→ dc:description → "Particle measurement tool, 150mm substrates, sub micron particles down to 0.2um, measurement time 30 sec on 6" wafers, particles sensitivity 0.2um diameter latex spheres, haze sensitivity 0.4ppm, spatial resolution 50um spacing minimum, measurement range 0.004um and 102um in twelve ranges and 256 gradations."^^xsd:string
→ rdfs:label → "All band tunable laser, 1440nm to 1640nm"^^xsd:string
→ dcterms:description → "Enable precise characterization of advanced optical components. Signal output with low spontaneous emission (SSE) permits measurement of filters with highest dynamic range. ¿Highest measurement range through low spontaneous source emission (low SSE), Signal to SSE Ratio >70 dB/nm[nl]
¿Variable sweep speed up to 80nm/s[nl]
¿Wide tuning range units cover all transmission bands: 1260nm-1640nm[nl]
¿Built-in high performance 60dB attenuator[nl]
¿Built-in wavemeter with excellent wavelength-accuracy +/-3.6pm"^^xsd:string
→ skos:notation → "E10297"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Enable precise characterization of advanced optical components. Signal output with low spontaneous emission (SSE) permits measurement of filters with highest dynamic range. ¿Highest measurement range through low spontaneous source emission (low SSE), Signal to SSE Ratio >70 dB/nm[nl]
¿Variable sweep speed up to 80nm/s[nl]
¿Wide tuning range units cover all transmission bands: 1260nm-1640nm[nl]
¿Built-in high performance 60dB attenuator[nl]
¿Built-in wavemeter with excellent wavelength-accuracy +/-3.6pm"^^xsd:string
→ dc:description → "Enable precise characterization of advanced optical components. Signal output with low spontaneous emission (SSE) permits measurement of filters with highest dynamic range. ¿Highest measurement range through low spontaneous source emission (low SSE), Signal to SSE Ratio >70 dB/nm[nl]
¿Variable sweep speed up to 80nm/s[nl]
¿Wide tuning range units cover all transmission bands: 1260nm-1640nm[nl]
¿Built-in high performance 60dB attenuator[nl]
¿Built-in wavemeter with excellent wavelength-accuracy +/-3.6pm"^^xsd:string
→ rdfs:label → "CW Tunable Laser System, comprising verdi- V6 WTR Riser Chiller etc"^^xsd:string
→ skos:notation → "E10298"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Optical Spectrum Analyser (AQ6315A)"^^xsd:string
→ dcterms:description → "¿Optical fiber loss wavelength characteristics.[nl]
¿Optical filter loss evaluation.[nl]
¿Fiber grating characteristics evaluation.[nl]
¿Color analysis.[nl]
¿Parameter evaluation for LED, FP-LD and FB-LD.[nl]
¿WDM device characteristics.[nl]
¿evaluation."^^xsd:string
→ skos:notation → "E10299"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "¿Optical fiber loss wavelength characteristics.[nl]
¿Optical filter loss evaluation.[nl]
¿Fiber grating characteristics evaluation.[nl]
¿Color analysis.[nl]
¿Parameter evaluation for LED, FP-LD and FB-LD.[nl]
¿WDM device characteristics.[nl]
¿evaluation."^^xsd:string
→ dc:description → "¿Optical fiber loss wavelength characteristics.[nl]
¿Optical filter loss evaluation.[nl]
¿Fiber grating characteristics evaluation.[nl]
¿Color analysis.[nl]
¿Parameter evaluation for LED, FP-LD and FB-LD.[nl]
¿WDM device characteristics.[nl]
¿evaluation."^^xsd:string
→ dcterms:description → "The Silica Fibre facilities occupy over 160 sq.m of class 10,000 cleanroom space and comprise state-of-the-art fabrication equipment. This includes modified chemical vapour deposition (MCVD) lathes, a glassworking lathe, a 6 metre high dual-sided fibre drawing tower, and dedicated chemical preparation areas for glass etching and machining. The facility is capable of producing standard preforms and optical fibre to a high quality as well as retaining the versatility to fabricate the huge variety of speciality fibres, including microstructured fibres required for research."^^xsd:string
→ skos:notation → "F10005"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Silica Fibre facilities occupy over 160 sq.m of class 10,000 cleanroom space and comprise state-of-the-art fabrication equipment. This includes modified chemical vapour deposition (MCVD) lathes, a glassworking lathe, a 6 metre high dual-sided fibre drawing tower, and dedicated chemical preparation areas for glass etching and machining. The facility is capable of producing standard preforms and optical fibre to a high quality as well as retaining the versatility to fabricate the huge variety of speciality fibres, including microstructured fibres required for research."^^xsd:string
→ dc:description → "The Silica Fibre facilities occupy over 160 sq.m of class 10,000 cleanroom space and comprise state-of-the-art fabrication equipment. This includes modified chemical vapour deposition (MCVD) lathes, a glassworking lathe, a 6 metre high dual-sided fibre drawing tower, and dedicated chemical preparation areas for glass etching and machining. The facility is capable of producing standard preforms and optical fibre to a high quality as well as retaining the versatility to fabricate the huge variety of speciality fibres, including microstructured fibres required for research."^^xsd:string
→ rdfs:label → "Optical Spectrum Analyser (AQ6370)"^^xsd:string
→ dcterms:description → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ skos:notation → "E10300"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ dc:description → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ rdfs:label → "Auto 306 Resistance Evaporation System"^^xsd:string
→ dcterms:description → "Desposition vaporator system. Evaporates commonly used metals (such as aluminum, chromium, silver, gold and many others)."^^xsd:string
→ skos:notation → "E10304"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Desposition vaporator system. Evaporates commonly used metals (such as aluminum, chromium, silver, gold and many others)."^^xsd:string
→ dc:description → "Desposition vaporator system. Evaporates commonly used metals (such as aluminum, chromium, silver, gold and many others)."^^xsd:string
→ rdfs:label → "Auto 500 Electron Beam Deposition System"^^xsd:string
→ dcterms:description → "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
→ skos:notation → "E10305"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
→ dc:description → "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
→ rdfs:label → "Clean Rooms - Integrated Photonics"^^xsd:string
→ dcterms:description → "The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
→ skos:notation → "F10010"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
→ dc:description → "The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
← is
oo:relatedFacility of
← http://id.southampton.ac.uk/equipment/E10305,
http://id.southampton.ac.uk/equipment/E10316,
http://id.southampton.ac.uk/equipment/E10319,
http://id.southampton.ac.uk/equipment/E10320,
http://id.southampton.ac.uk/equipment/E10321,
http://id.southampton.ac.uk/equipment/E10322,
http://id.southampton.ac.uk/equipment/E10323,
http://id.southampton.ac.uk/equipment/E10329,
http://id.southampton.ac.uk/equipment/E10332,
http://id.southampton.ac.uk/equipment/E10348,
http://id.southampton.ac.uk/equipment/E10362,
http://id.southampton.ac.uk/equipment/E10373,
http://id.southampton.ac.uk/equipment/E10387,
http://id.southampton.ac.uk/equipment/E10388,
http://id.southampton.ac.uk/equipment/E10494,
http://id.southampton.ac.uk/equipment/E10840,
http://id.southampton.ac.uk/equipment/E11272,
http://id.southampton.ac.uk/equipment/E11273,
http://id.southampton.ac.uk/equipment/E11274
→ rdfs:label → "Optical Spectrum Analyser (AQ6370)"^^xsd:string
→ dcterms:description → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ skos:notation → "E10306"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ dc:description → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ rdfs:label → "Optical Spectrum Analyser (AQ6370)"^^xsd:string
→ skos:notation → "E10307"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Optical Spectrum Analyser (AQ6370)"^^xsd:string
→ dcterms:description → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ skos:notation → "E10308"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ dc:description → "The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm[nl]
- Wide close-in dynamic range[nl]
- Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm.[nl]
- Pulsed light measurement capability"^^xsd:string
→ rdfs:label → "Platinum Liner & Buffer Plate"^^xsd:string
→ skos:notation → "E10314"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Glove Box 1: 2-Port Box / Glove Box 2: 4-Port Box"^^xsd:string
→ skos:notation → "E10315"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Clean Rooms - Novel Glass"^^xsd:string
→ dcterms:description → "Our Novel glass facilties offer a wide range of specialized glass making and fibre drawing equipment including: a variety of horizontal and vertical tube furnaces, chamber furnaces, high and low temperature ovens, vacuum processing, L-shaped glove box system for batching, melting, annealing and casting of glass under dry nitrogen atmosphere (10ppm), testometric extrusion equipment, hydraulic extrusion equipment, thermogravimetric and thermomechanical analyzers."^^xsd:string
→ skos:notation → "F10007"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Our Novel glass facilties offer a wide range of specialized glass making and fibre drawing equipment including: a variety of horizontal and vertical tube furnaces, chamber furnaces, high and low temperature ovens, vacuum processing, L-shaped glove box system for batching, melting, annealing and casting of glass under dry nitrogen atmosphere (10ppm), testometric extrusion equipment, hydraulic extrusion equipment, thermogravimetric and thermomechanical analyzers."^^xsd:string
→ dc:description → "Our Novel glass facilties offer a wide range of specialized glass making and fibre drawing equipment including: a variety of horizontal and vertical tube furnaces, chamber furnaces, high and low temperature ovens, vacuum processing, L-shaped glove box system for batching, melting, annealing and casting of glass under dry nitrogen atmosphere (10ppm), testometric extrusion equipment, hydraulic extrusion equipment, thermogravimetric and thermomechanical analyzers."^^xsd:string
→ rdfs:label → "600C Environmental Oven"^^xsd:string
→ skos:notation → "E10316"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "P-16+ Stylus Surface Profiler"^^xsd:string
→ dcterms:description → "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
→ skos:notation → "E10319"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
→ dc:description → "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
→ rdfs:label → "KLA Tencor Alpha Step IQ Stylus Profier"^^xsd:string
→ dcterms:description → "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
→ skos:notation → "E10320"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
→ dc:description → "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
→ rdfs:label → "MRF High Temperature Vacuum Furnace"^^xsd:string
→ dcterms:description → "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen."^^xsd:string
→ skos:notation → "E10321"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen."^^xsd:string
→ dc:description → "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen."^^xsd:string
→ rdfs:label → "Plasmalab 80 Plus / Compact Modular Plasma System"^^xsd:string
→ dcterms:description → "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
→ skos:notation → "E10322"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
→ dc:description → "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
→ rdfs:label → "Plasmalab System 400 / Magnetron Sputtering System"^^xsd:string
→ dcterms:description → "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films."^^xsd:string
→ skos:notation → "E10323"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films."^^xsd:string
→ dc:description → "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films."^^xsd:string
→ dcterms:description → "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer"^^xsd:string
→ skos:notation → "E10329"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer"^^xsd:string
→ dc:description → "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer"^^xsd:string
→ rdfs:label → "Modified Material Testing Machine (M500-100CT)"^^xsd:string
→ dcterms:description → "The CT 500 range of twin column, computer controlled universal materials testing machine using Testometric's feature-rich winTest¿ software running under the Windows¿ operating system. Test setups are fully configurable and simple or more complex multi-stage test routines are controlled using the standard PC serial interface."^^xsd:string
→ skos:notation → "E10330"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The CT 500 range of twin column, computer controlled universal materials testing machine using Testometric's feature-rich winTest¿ software running under the Windows¿ operating system. Test setups are fully configurable and simple or more complex multi-stage test routines are controlled using the standard PC serial interface."^^xsd:string
→ dc:description → "The CT 500 range of twin column, computer controlled universal materials testing machine using Testometric's feature-rich winTest¿ software running under the Windows¿ operating system. Test setups are fully configurable and simple or more complex multi-stage test routines are controlled using the standard PC serial interface."^^xsd:string
→ rdfs:label → "Fibre Tapering & Bundling System (obsolete 1718)"^^xsd:string
→ dcterms:description → "Offers precision fusion splicing and fused fiber components critical to high-power fiber laser performance. This includes creating combiners and tapers, large mode area (LMA) fiber splicing, photonic crystal fiber (PCF) splicing, and large diameter fiber splicing with low loss."^^xsd:string
→ skos:notation → "E10331"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Offers precision fusion splicing and fused fiber components critical to high-power fiber laser performance. This includes creating combiners and tapers, large mode area (LMA) fiber splicing, photonic crystal fiber (PCF) splicing, and large diameter fiber splicing with low loss."^^xsd:string
→ dc:description → "Offers precision fusion splicing and fused fiber components critical to high-power fiber laser performance. This includes creating combiners and tapers, large mode area (LMA) fiber splicing, photonic crystal fiber (PCF) splicing, and large diameter fiber splicing with low loss."^^xsd:string
→ rdfs:label → "Ionfab 300 Plus / Load Locked Ion Beam Etch System"^^xsd:string
→ dcterms:description → "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
→ skos:notation → "E10332"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
→ dc:description → "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
→ dcterms:description → " The EVO®50 series provides quality results from a versatile analytical microscope with a very large specimen chamber. Whether the specimen requires imaging in high vacuum, XVP® or EP, the EVO®50 series is able to image to perfection."^^xsd:string
→ skos:notation → "E10333"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → " The EVO®50 series provides quality results from a versatile analytical microscope with a very large specimen chamber. Whether the specimen requires imaging in high vacuum, XVP® or EP, the EVO®50 series is able to image to perfection."^^xsd:string
→ dc:description → " The EVO®50 series provides quality results from a versatile analytical microscope with a very large specimen chamber. Whether the specimen requires imaging in high vacuum, XVP® or EP, the EVO®50 series is able to image to perfection."^^xsd:string
→ rdfs:label → "Scanning Electron Microscope (SEM)"^^xsd:string
→ dcterms:description → "The ORC SEM Facility comprises of a Zeiss Evo50 SEM fitted with an Oxford Instruments INCA 250 x-ray analysis system. In addition to dedicated Gold and Carbon deposition equipment, the SEM features variable pressure operation allowing analysis of both conductive and non-conductive sample. The INCA 250 x-ray analysis system provides elemental analysis capabilities."^^xsd:string
→ skos:notation → "F10012"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The ORC SEM Facility comprises of a Zeiss Evo50 SEM fitted with an Oxford Instruments INCA 250 x-ray analysis system. In addition to dedicated Gold and Carbon deposition equipment, the SEM features variable pressure operation allowing analysis of both conductive and non-conductive sample. The INCA 250 x-ray analysis system provides elemental analysis capabilities."^^xsd:string
→ dc:description → "The ORC SEM Facility comprises of a Zeiss Evo50 SEM fitted with an Oxford Instruments INCA 250 x-ray analysis system. In addition to dedicated Gold and Carbon deposition equipment, the SEM features variable pressure operation allowing analysis of both conductive and non-conductive sample. The INCA 250 x-ray analysis system provides elemental analysis capabilities."^^xsd:string
→ rdfs:label → "Soft Glass Fiber Drawing Tower"^^xsd:string
→ skos:notation → "E10335"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Dual Sided Drawing Tower"^^xsd:string
→ dcterms:description → " 6 metre high dual-sided fibre drawing tower which is suitable for a range of silica-based optical fibres. Preforms up to 60 mm in diameter can be drawn into fibre utilising a unique furnace design. The drawing tower is also designed to accommodate the fabrication and coating of large diameter fibres, up to 1 mm in diameter, as well as ribbon geometries, and forms part of our research into high power (kW) fibre lasers"^^xsd:string
→ skos:notation → "E10336"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → " 6 metre high dual-sided fibre drawing tower which is suitable for a range of silica-based optical fibres. Preforms up to 60 mm in diameter can be drawn into fibre utilising a unique furnace design. The drawing tower is also designed to accommodate the fabrication and coating of large diameter fibres, up to 1 mm in diameter, as well as ribbon geometries, and forms part of our research into high power (kW) fibre lasers"^^xsd:string
→ dc:description → " 6 metre high dual-sided fibre drawing tower which is suitable for a range of silica-based optical fibres. Preforms up to 60 mm in diameter can be drawn into fibre utilising a unique furnace design. The drawing tower is also designed to accommodate the fabrication and coating of large diameter fibres, up to 1 mm in diameter, as well as ribbon geometries, and forms part of our research into high power (kW) fibre lasers"^^xsd:string
→ rdfs:label → "Planar Air Bearing System"^^xsd:string
→ dcterms:description → "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
→ skos:notation → "E10348"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
→ dc:description → "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
→ rdfs:label → "Laser Guages For Tower"^^xsd:string
→ skos:notation → "E10350"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Soft Glass Drawing Tower"^^xsd:string
→ skos:notation → "E10351"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Special Furnace System"^^xsd:string
→ skos:notation → "E10352"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Quartz Tube Washer - Model 6600"^^xsd:string
→ skos:notation → "E10353"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10355"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Pressurization system"^^xsd:string
→ skos:notation → "E10359"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10362"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Elevator Hearth Furnace (EHF 1818)"^^xsd:string
→ skos:notation → "E10363"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Fibre Rewinder & Proof Tester"^^xsd:string
→ skos:notation → "E10365"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Gantry Platform For 6M Silca Tower"^^xsd:string
→ skos:notation → "E10368"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Three Zone, Bench Top 1700C Tube Furnace"^^xsd:string
→ skos:notation → "E10373"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Newport Spectra Physics Mai Tai HP Ti:Sapphire Laser"^^xsd:string
→ dcterms:description → "Fully-automated mode-locked Ti:Sapphire laser: Spectral range 690-1040 nm; < 100 fs pulsewidth; > 2500 mW power at 800 nm"^^xsd:string
→ skos:notation → "E10382"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Fully-automated mode-locked Ti:Sapphire laser: Spectral range 690-1040 nm; < 100 fs pulsewidth; > 2500 mW power at 800 nm"^^xsd:string
→ dc:description → "Fully-automated mode-locked Ti:Sapphire laser: Spectral range 690-1040 nm; < 100 fs pulsewidth; > 2500 mW power at 800 nm"^^xsd:string
→ rdfs:label → "Newport Spectra Physics Inspire HF100 Tuneable OPO"^^xsd:string
→ dcterms:description → "Hands-Free fully-automated fs OPO for gap-free operation at wavelengths from 345-2500 nm"^^xsd:string
→ skos:notation → "E10383"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Hands-Free fully-automated fs OPO for gap-free operation at wavelengths from 345-2500 nm"^^xsd:string
→ dc:description → "Hands-Free fully-automated fs OPO for gap-free operation at wavelengths from 345-2500 nm"^^xsd:string
→ rdfs:label → "OVD Deposition Lathe & Furnace"^^xsd:string
→ skos:notation → "E10384"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Nanolink DPN 5000 System"^^xsd:string
→ skos:notation → "E10387"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "ZeMetrics ZeScope Optical Profiling System"^^xsd:string
→ skos:notation → "E10388"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Backscatter Reflectometer (obsolete 1718)"^^xsd:string
→ skos:notation → "E10390"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10396"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "MAX-XP Benchtop Ultra Centrifuge"^^xsd:string
→ skos:notation → "E10397"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Nikon Microscope system"^^xsd:string
→ skos:notation → "E10398"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10422"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Radio Frequency Test Kit"^^xsd:string
→ skos:notation → "E10434"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10435"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10436"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Gis System For Orion Microscope"^^xsd:string
→ skos:notation → "E10438"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Gis System For Orion Microscope"^^xsd:string
→ skos:notation → "E10442"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10443"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Quantum Efficiency System"^^xsd:string
→ skos:notation → "E10446"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10448"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Software Expansion Pack For E-Beam"^^xsd:string
→ skos:notation → "E10449"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ dcterms:description → "Solar simulators provide a broadband spectrum close to that of the sun from the UV to the IR. The main part of the solar simulator is a xenon arc lamp that reaches a color temperature of almost 6000K which is very close to sun light. We provide solar simulators with a wide range of luminous fields for different sample sizes and budgets, varying in size from 25 mm to 260 mm x 260 mm in diameter. The irradiance (W/m²) depends on the size of the desired output beam, the lamp¿s power input and the layout of the simulator¿s optic. The spectral characteristics are always the same."^^xsd:string
→ skos:notation → "E10450"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Solar simulators provide a broadband spectrum close to that of the sun from the UV to the IR. The main part of the solar simulator is a xenon arc lamp that reaches a color temperature of almost 6000K which is very close to sun light. We provide solar simulators with a wide range of luminous fields for different sample sizes and budgets, varying in size from 25 mm to 260 mm x 260 mm in diameter. The irradiance (W/m²) depends on the size of the desired output beam, the lamp¿s power input and the layout of the simulator¿s optic. The spectral characteristics are always the same."^^xsd:string
→ dc:description → "Solar simulators provide a broadband spectrum close to that of the sun from the UV to the IR. The main part of the solar simulator is a xenon arc lamp that reaches a color temperature of almost 6000K which is very close to sun light. We provide solar simulators with a wide range of luminous fields for different sample sizes and budgets, varying in size from 25 mm to 260 mm x 260 mm in diameter. The irradiance (W/m²) depends on the size of the desired output beam, the lamp¿s power input and the layout of the simulator¿s optic. The spectral characteristics are always the same."^^xsd:string
→ skos:notation → "E10451"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10452"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Orion Performance Upgrade Package"^^xsd:string
→ skos:notation → "E10453"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Orion Variable Accelerating Voltage Package"^^xsd:string
→ skos:notation → "E10454"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Orion Liquid Nitrogen Cooling Dewar System"^^xsd:string
→ skos:notation → "E10455"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10456"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10458"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Semiconductor Analyser"^^xsd:string
→ skos:notation → "E10459"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10460"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Laser Lithography System"^^xsd:string
→ skos:notation → "E10464"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Cryogenic Probe Station"^^xsd:string
→ skos:notation → "E10465"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10466"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10467"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10468"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ dcterms:description → "Vitesse Duo are diode-pumped solid-state lasers using a 10W Verdi CW laser to both seed the Vitesse ultrafast oscillator and pump the RegA. The result is a compact and economical, 2-box, all-solid-state solution for high repetition rate, ultrafast amplification."^^xsd:string
→ skos:notation → "E10469"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Vitesse Duo are diode-pumped solid-state lasers using a 10W Verdi CW laser to both seed the Vitesse ultrafast oscillator and pump the RegA. The result is a compact and economical, 2-box, all-solid-state solution for high repetition rate, ultrafast amplification."^^xsd:string
→ dc:description → "Vitesse Duo are diode-pumped solid-state lasers using a 10W Verdi CW laser to both seed the Vitesse ultrafast oscillator and pump the RegA. The result is a compact and economical, 2-box, all-solid-state solution for high repetition rate, ultrafast amplification."^^xsd:string
→ rdfs:label → "Dry Bed Absorber System"^^xsd:string
→ skos:notation → "E10471"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Zeiss EVO Scanning Electron Microscope"^^xsd:string
→ dcterms:description → "The scanning electron microscope (SEM) is used to examine microscopic topographical or compositional detail of solid specimens. The image is produced by scanning an extremely small focused beam of electrons (adjustable down to a few nm in diameter) across the surface of a specimen in an array of picture points; high-energy electron bombardment of the specimen causes signals to be emitted at each position of the beam. These are collected and their intensities are used to produce images of the specimen by modulating the brightness of equivalent pixels on a computer screen. An SEM has three distinct advantages compared to a light microscope - better resolution, greater depth of field and the ability to carry out X-ray microanalysis. The Zeiss EVO scanning electon microscope (SEM) is able to image the surfaces of a wide variety of non-conducting materials due to its variable pressure (VP) mode."^^xsd:string
→ skos:notation → "E10472"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The scanning electron microscope (SEM) is used to examine microscopic topographical or compositional detail of solid specimens. The image is produced by scanning an extremely small focused beam of electrons (adjustable down to a few nm in diameter) across the surface of a specimen in an array of picture points; high-energy electron bombardment of the specimen causes signals to be emitted at each position of the beam. These are collected and their intensities are used to produce images of the specimen by modulating the brightness of equivalent pixels on a computer screen. An SEM has three distinct advantages compared to a light microscope - better resolution, greater depth of field and the ability to carry out X-ray microanalysis. The Zeiss EVO scanning electon microscope (SEM) is able to image the surfaces of a wide variety of non-conducting materials due to its variable pressure (VP) mode."^^xsd:string
→ dc:description → "The scanning electron microscope (SEM) is used to examine microscopic topographical or compositional detail of solid specimens. The image is produced by scanning an extremely small focused beam of electrons (adjustable down to a few nm in diameter) across the surface of a specimen in an array of picture points; high-energy electron bombardment of the specimen causes signals to be emitted at each position of the beam. These are collected and their intensities are used to produce images of the specimen by modulating the brightness of equivalent pixels on a computer screen. An SEM has three distinct advantages compared to a light microscope - better resolution, greater depth of field and the ability to carry out X-ray microanalysis. The Zeiss EVO scanning electon microscope (SEM) is able to image the surfaces of a wide variety of non-conducting materials due to its variable pressure (VP) mode."^^xsd:string
→ rdfs:label → "Elemental Analysis: O-Orion-Rbs"^^xsd:string
→ skos:notation → "E10473"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Clear View: O-Orion-Clearview"^^xsd:string
→ skos:notation → "E10474"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Gatan X-ray Ultramicroscope (XuM) (accessory for the EVO SEM LS25 microscope)"^^xsd:string
→ dcterms:description → "The Gatan XuM utilises the electron beam in an scanning electron microscope to generate X-rays which are projected through a sample and onto an X-ray camera to form an image. This provides non-destructive imaging of the internal structure of suitable samples. The sample can be rotated and re-imaged multiple times to build up a tomographic dataset from which a 3D reconstruction of the sample can be generated. The resolution limit of this technique is ~400 nm."^^xsd:string
→ skos:notation → "E10475"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Gatan XuM utilises the electron beam in an scanning electron microscope to generate X-rays which are projected through a sample and onto an X-ray camera to form an image. This provides non-destructive imaging of the internal structure of suitable samples. The sample can be rotated and re-imaged multiple times to build up a tomographic dataset from which a 3D reconstruction of the sample can be generated. The resolution limit of this technique is ~400 nm."^^xsd:string
→ dc:description → "The Gatan XuM utilises the electron beam in an scanning electron microscope to generate X-rays which are projected through a sample and onto an X-ray camera to form an image. This provides non-destructive imaging of the internal structure of suitable samples. The sample can be rotated and re-imaged multiple times to build up a tomographic dataset from which a 3D reconstruction of the sample can be generated. The resolution limit of this technique is ~400 nm."^^xsd:string
→ skos:notation → "E10476"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10477"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Analysers/Generator - 3 Items Each Over £25K"^^xsd:string
→ skos:notation → "E10478"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10488"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Nano 38 Sputting Machine Lesker Sputter System"^^xsd:string
→ skos:notation → "E10494"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Anechoic Chamber Project"^^xsd:string
→ skos:notation → "E10497"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Supplier Name: Emerson & Cuming Microwave Products"^^xsd:string
→ dc:description → "Supplier Name: Emerson & Cuming Microwave Products"^^xsd:string
→ rdfs:label → "CamScan CS3200 Scanning Electron Microscope + parts"^^xsd:string
→ dcterms:description → "Scanning electron microscope (LaB6 source; 0-50 keV) equipped for VI-NIR spectroscopic analysis and angle-resolved mapping of electron-induced light emission (cf. cathodoluminescence)"^^xsd:string
→ skos:notation → "E10514"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Scanning electron microscope (LaB6 source; 0-50 keV) equipped for VI-NIR spectroscopic analysis and angle-resolved mapping of electron-induced light emission (cf. cathodoluminescence)"^^xsd:string
→ dc:description → "Scanning electron microscope (LaB6 source; 0-50 keV) equipped for VI-NIR spectroscopic analysis and angle-resolved mapping of electron-induced light emission (cf. cathodoluminescence)"^^xsd:string
→ rdfs:label → "Omicron Twin SNOM System"^^xsd:string
→ dcterms:description → "The TwinSNOM combines conventional microscopy, SNOM, shear-force AFM and optionally even laser scanning confocal microscopy or Needle-Sensor AFM in a single instrument."^^xsd:string
→ skos:notation → "E10609"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The TwinSNOM combines conventional microscopy, SNOM, shear-force AFM and optionally even laser scanning confocal microscopy or Needle-Sensor AFM in a single instrument."^^xsd:string
→ dc:description → "The TwinSNOM combines conventional microscopy, SNOM, shear-force AFM and optionally even laser scanning confocal microscopy or Needle-Sensor AFM in a single instrument."^^xsd:string
→ rdfs:label → "Cryostat (5k to 600k)"^^xsd:string
→ skos:notation → "E10612"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "EVG501 Semi-Automated Lamination Machine"^^xsd:string
→ skos:notation → "E10613"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "EVG620 Double Side Mask Aligner"^^xsd:string
→ dcterms:description → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers."^^xsd:string
→ skos:notation → "E10614"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers."^^xsd:string
→ dc:description → "The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers."^^xsd:string
→ rdfs:label → "EVG150 Automated Resist Processing System"^^xsd:string
→ dcterms:description → "Designed to provide the widest range of process variations, the EVG100 series` modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements. These systems accommodate the processing of an extensive range of materials such as positive and negative resists, polyimides, double-sided coating of thin resist layers, high viscosity resists, and edge protection coatings."^^xsd:string
→ skos:notation → "E10615"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Designed to provide the widest range of process variations, the EVG100 series` modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements. These systems accommodate the processing of an extensive range of materials such as positive and negative resists, polyimides, double-sided coating of thin resist layers, high viscosity resists, and edge protection coatings."^^xsd:string
→ dc:description → "Designed to provide the widest range of process variations, the EVG100 series` modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements. These systems accommodate the processing of an extensive range of materials such as positive and negative resists, polyimides, double-sided coating of thin resist layers, high viscosity resists, and edge protection coatings."^^xsd:string
→ rdfs:label → "3 Stacis "Quiet Island" Support Systems"^^xsd:string
→ dcterms:description → "These systems are actively-damped tables onto which senstive pieces of equipment can be mounted to isolate them from vibrational interference. These are current employed underneath the Zeiss Orion Helium Ion Microscope, the Zeiss Nvision40 Focused Ion Beam and the Zeiss EVO Scanning Electron Microscope."^^xsd:string
→ skos:notation → "E10617"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "These systems are actively-damped tables onto which senstive pieces of equipment can be mounted to isolate them from vibrational interference. These are current employed underneath the Zeiss Orion Helium Ion Microscope, the Zeiss Nvision40 Focused Ion Beam and the Zeiss EVO Scanning Electron Microscope."^^xsd:string
→ dc:description → "These systems are actively-damped tables onto which senstive pieces of equipment can be mounted to isolate them from vibrational interference. These are current employed underneath the Zeiss Orion Helium Ion Microscope, the Zeiss Nvision40 Focused Ion Beam and the Zeiss EVO Scanning Electron Microscope."^^xsd:string
→ rdfs:label → "Horiba UVISEL-2 Spectroscopic Ellipsometer"^^xsd:string
→ skos:notation → "E10674"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "UV-NIR variable-angle spectroscopic ellipsometer"^^xsd:string
→ dc:description → "UV-NIR variable-angle spectroscopic ellipsometer"^^xsd:string
→ skos:notation → "E10689"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Opt System 100 Pecvd Liquid Source"^^xsd:string
→ skos:notation → "E10690"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Plasmalab 80 Plus Rie Etcher"^^xsd:string
→ skos:notation → "E10691"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Additional Parts For Evg620Tb"^^xsd:string
→ skos:notation → "E10703"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "DC Sputter (Enhancement To Helios Sputter Tool)"^^xsd:string
→ skos:notation → "E10708"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10710"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Theta Probe Angle-Resolved X-ray Photoelectron Spectrometer (ARXPS) System"^^xsd:string
→ dcterms:description → "The Theta Probe X-ray Photoelectron Spectromer (XPS) allows the collection of angle-resolved spectra without the need to tilt the sample to nondestructively characterize ultra-thin layers."^^xsd:string
→ skos:notation → "E10712"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Theta Probe X-ray Photoelectron Spectromer (XPS) allows the collection of angle-resolved spectra without the need to tilt the sample to nondestructively characterize ultra-thin layers."^^xsd:string
→ dc:description → "The Theta Probe X-ray Photoelectron Spectromer (XPS) allows the collection of angle-resolved spectra without the need to tilt the sample to nondestructively characterize ultra-thin layers."^^xsd:string
→ rdfs:label → "Chameleon Laser System"^^xsd:string
→ skos:notation → "E10721"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Super Continuum System"^^xsd:string
→ skos:notation → "E10722"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Fianium WhiteLase Supercontinuum Laser"^^xsd:string
→ dcterms:description → "Supercontinuum (<460 to >2400 nm) laser source; 20 MHz rep. rate; 2 W average power"^^xsd:string
→ skos:notation → "E10738"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Supercontinuum (<460 to >2400 nm) laser source; 20 MHz rep. rate; 2 W average power"^^xsd:string
→ dc:description → "Supercontinuum (<460 to >2400 nm) laser source; 20 MHz rep. rate; 2 W average power"^^xsd:string
→ rdfs:label → "Optical time domain reflectometer"^^xsd:string
→ skos:notation → "E10740"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "XF2 Insulator Enhanced Etch Gas Injector"^^xsd:string
→ dcterms:description → "Gas injection system for chemically-assisted focused ion beam milling of insulating materials"^^xsd:string
→ skos:notation → "E10741"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Gas injection system for chemically-assisted focused ion beam milling of insulating materials"^^xsd:string
→ dc:description → "Gas injection system for chemically-assisted focused ion beam milling of insulating materials"^^xsd:string
→ rdfs:label → "Clean Rooms - Focused ion beam (FIB)"^^xsd:string
→ dcterms:description → "Allows focused ion beam milling, electron-beam lithography and ion/electron beam-induced deposition, with parallel high resolution imaging, for the production of complex nanostructures in a broad range of materials. [nl]
Specification: 0.9 nm electron beam and 5 nm ion beam resoultion - Gas injection for bea-induced deposition of gold and platinum - Nabity pattern generator - Electron - beam lithography capability - Kleidiek nanomanipulator for TEM sample lift-out (other tool options available inc. microfluidic injection and four-point electrical probe) - 5-axis motorized stage for samples up to 150mm dia. (larger without full rotation) and 20mm thick - Ability to accept complex CAD pattern files."^^xsd:string
→ skos:notation → "F10011"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Allows focused ion beam milling, electron-beam lithography and ion/electron beam-induced deposition, with parallel high resolution imaging, for the production of complex nanostructures in a broad range of materials. [nl]
Specification: 0.9 nm electron beam and 5 nm ion beam resoultion - Gas injection for bea-induced deposition of gold and platinum - Nabity pattern generator - Electron - beam lithography capability - Kleidiek nanomanipulator for TEM sample lift-out (other tool options available inc. microfluidic injection and four-point electrical probe) - 5-axis motorized stage for samples up to 150mm dia. (larger without full rotation) and 20mm thick - Ability to accept complex CAD pattern files."^^xsd:string
→ dc:description → "Allows focused ion beam milling, electron-beam lithography and ion/electron beam-induced deposition, with parallel high resolution imaging, for the production of complex nanostructures in a broad range of materials. [nl]
Specification: 0.9 nm electron beam and 5 nm ion beam resoultion - Gas injection for bea-induced deposition of gold and platinum - Nabity pattern generator - Electron - beam lithography capability - Kleidiek nanomanipulator for TEM sample lift-out (other tool options available inc. microfluidic injection and four-point electrical probe) - 5-axis motorized stage for samples up to 150mm dia. (larger without full rotation) and 20mm thick - Ability to accept complex CAD pattern files."^^xsd:string
→ rdfs:label → "Orion 8 Sputter System"^^xsd:string
→ skos:notation → "E10757"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Nitor 301 Hot Filament Chemical Vapour Deposition (HFCVD)"^^xsd:string
→ dcterms:description → "The Nitor 301 Hot Filament Chemical Vapour Deposition (HFCVD), also known as Hot Wire Chemical Vapour Deposition (HWCVD), is used for deposition of intrinsic and doped amorphous and crystalline silicon films. It uses a proprietary hot filament array on a deposition area of up to 300 x 300 mm."^^xsd:string
→ skos:notation → "E10758"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The Nitor 301 Hot Filament Chemical Vapour Deposition (HFCVD), also known as Hot Wire Chemical Vapour Deposition (HWCVD), is used for deposition of intrinsic and doped amorphous and crystalline silicon films. It uses a proprietary hot filament array on a deposition area of up to 300 x 300 mm."^^xsd:string
→ dc:description → "The Nitor 301 Hot Filament Chemical Vapour Deposition (HFCVD), also known as Hot Wire Chemical Vapour Deposition (HWCVD), is used for deposition of intrinsic and doped amorphous and crystalline silicon films. It uses a proprietary hot filament array on a deposition area of up to 300 x 300 mm."^^xsd:string
→ rdfs:label → "Thermal imaging camera"^^xsd:string
→ skos:notation → "E10761"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Tunable laser source family"^^xsd:string
→ skos:notation → "E10762"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "10-50 PNA Network Analyser"^^xsd:string
→ skos:notation → "E10772"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10786"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Savannah ALT S200 System"^^xsd:string
→ skos:notation → "E10788"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10789"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Glove Box with Gas Purification"^^xsd:string
→ skos:notation → "E10838"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Plasma System 300 (S/N 1314)"^^xsd:string
→ skos:notation → "E10839"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "PVA Tepla 300 Plasma System"^^xsd:string
→ skos:notation → "E10840"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10845"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10846"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Additional Gas Supply to PO 60155802"^^xsd:string
→ skos:notation → "E10852"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ skos:notation → "E10864"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "TGA-200 Complete System plus accessories"^^xsd:string
→ skos:notation → "E10885"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Broadband Tunable Laser System with MCT detectors"^^xsd:string
→ skos:notation → "E10903"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Laser tune QCL system with TEC MCT detector including upgrade and standard accessories"^^xsd:string
→ skos:notation → "E10916"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "FLIR SC660 Camera with lens and microlens"^^xsd:string
→ skos:notation → "E10961"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "M Squared - Firefly-IR Widely Tunable, Pulsed Mid-Infrared Laser Tuning Range A"^^xsd:string
→ skos:notation → "E10969"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "FLIR A6540 Thermal Imaging Camera plus FLIR Microscope Lens"^^xsd:string
→ skos:notation → "E10974"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Biophotonics Solutions MIIPS Box640 Pulse Shaper"^^xsd:string
→ dcterms:description → "Fully-automated SLM-based measurement and compression of femtosecond laser pulses; Arbitrary phase and amplitude modulation"^^xsd:string
→ skos:notation → "E10978"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Fully-automated SLM-based measurement and compression of femtosecond laser pulses; Arbitrary phase and amplitude modulation"^^xsd:string
→ dc:description → "Fully-automated SLM-based measurement and compression of femtosecond laser pulses; Arbitrary phase and amplitude modulation"^^xsd:string
→ rdfs:label → "Femtolasers Integral Element PRO-500 Utrashort Pulse Oscillator"^^xsd:string
→ dcterms:description → "Hands-free femtosecond oscillator generating sub-10 fs pulses: >100 nm bandwidth at 800 nm; >500 mW average output power"^^xsd:string
→ skos:notation → "E11007"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Hands-free femtosecond oscillator generating sub-10 fs pulses: >100 nm bandwidth at 800 nm; >500 mW average output power"^^xsd:string
→ dc:description → "Hands-free femtosecond oscillator generating sub-10 fs pulses: >100 nm bandwidth at 800 nm; >500 mW average output power"^^xsd:string
→ rdfs:label → "DISCO DAD3430 Semi Automatic Dicing Saw"^^xsd:string
→ skos:notation → "E11042"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "DISCO DCS1440 Automatic Cleaning System"^^xsd:string
→ skos:notation → "E11043"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "DMOptics Yokogawa AQ6370D-10-L1 Optical Spectrum Analyzer"^^xsd:string
→ skos:notation → "E11046"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "PO60489087 Subproject 514689104"^^xsd:string
→ rdfs:label → "DMOptics Yokogawa AQ6373 Optical Spectrum Analyzer"^^xsd:string
→ skos:notation → "E11047"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Fujikura FSM-100PPLUS Speciality Splicer Serial No. 1724"^^xsd:string
→ skos:notation → "E11067"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "LAZERMaster LZM-100 Glass Processing and Splicing System Serial No. 201 (and optional extras)"^^xsd:string
→ skos:notation → "E11069"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Zurich Instruments UHF Lock-In Amplifier"^^xsd:string
→ dcterms:description → "Digital lock-in amplifier covering the frequency range from DC to 600 MHz;"^^xsd:string
→ skos:notation → "E11075"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Digital lock-in amplifier covering the frequency range from DC to 600 MHz;"^^xsd:string
→ dc:description → "Digital lock-in amplifier covering the frequency range from DC to 600 MHz;"^^xsd:string
→ rdfs:label → "SLM213 Solid-State Laser System"^^xsd:string
→ skos:notation → "E11165"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "subproject code 514689104 PO60500186"^^xsd:string
→ rdfs:label → "Firestar ti100 100w 9.3um laser system"^^xsd:string
→ skos:notation → "E11213"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "Tuneable Laser Source O-band model TSL-550"^^xsd:string
→ dcterms:description → "Tuneable Laser Source[cr][nl]
Model: TLS-550[cr][nl]
Serial number: 16110034[cr][nl]
Wavelength Band: 1260 – 1360nm"^^xsd:string
→ skos:notation → "E11263"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Tuneable Laser Source[cr][nl]
Model: TLS-550[cr][nl]
Serial number: 16110034[cr][nl]
Wavelength Band: 1260 – 1360nm"^^xsd:string
→ dc:description → "Tuneable Laser Source[cr][nl]
Model: TLS-550[cr][nl]
Serial number: 16110034[cr][nl]
Wavelength Band: 1260 – 1360nm"^^xsd:string
→ rdfs:label → "Flame Hydrolysis Deposition Chamber - 1 of 2"^^xsd:string
→ skos:notation → "E11272"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Flame Hydrolysis Deposition Chamber"^^xsd:string
→ rdfs:label → "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
→ skos:notation → "E11273"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
→ dc:description → "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
→ skos:notation → "E11274"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:label → "FAST Lab - Laser Laboratory"^^xsd:string
→ dcterms:description → "The FAST LAB facility consists of three sections (one `clean` lab dedicated to optical bio-science) and the other two supplied with femtosecond laser systems and optical tables with a total floor space of 72 square metres. The £1.1M installation and recent £300K upgrade provides the ORC and its collaborators with one of the most comprehensive and flexible commercial ultrafast laser system in the world. The FAST Lab can be hired on a daily basis in order to assist your particular line of research. Whether you are a member of the ORC, a member of another department within this or another university, or even a scientist from industry or other research establishment, you are welcome to make use of the FAST Lab facility. Moreover, we are keen to establish collaborations with other experimentalists"^^xsd:string
→ skos:notation → "F10006"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The FAST LAB facility consists of three sections (one `clean` lab dedicated to optical bio-science) and the other two supplied with femtosecond laser systems and optical tables with a total floor space of 72 square metres. The £1.1M installation and recent £300K upgrade provides the ORC and its collaborators with one of the most comprehensive and flexible commercial ultrafast laser system in the world. The FAST Lab can be hired on a daily basis in order to assist your particular line of research. Whether you are a member of the ORC, a member of another department within this or another university, or even a scientist from industry or other research establishment, you are welcome to make use of the FAST Lab facility. Moreover, we are keen to establish collaborations with other experimentalists"^^xsd:string
→ dc:description → "The FAST LAB facility consists of three sections (one `clean` lab dedicated to optical bio-science) and the other two supplied with femtosecond laser systems and optical tables with a total floor space of 72 square metres. The £1.1M installation and recent £300K upgrade provides the ORC and its collaborators with one of the most comprehensive and flexible commercial ultrafast laser system in the world. The FAST Lab can be hired on a daily basis in order to assist your particular line of research. Whether you are a member of the ORC, a member of another department within this or another university, or even a scientist from industry or other research establishment, you are welcome to make use of the FAST Lab facility. Moreover, we are keen to establish collaborations with other experimentalists"^^xsd:string
→ rdfs:label → "Clean Rooms - Compound Glass"^^xsd:string
→ dcterms:description → "Our Soft Glass facilities offer a wide range of specialized glass making and fibre drawing equipment including: [nl]
A 5m Fibre Drawing Tower with cane and fibre drawing capabilities up to 1100oC; High Temperature (1700oC & 1800oC) Elevator Hearth Furnaces and High Temperature (1200oC)Chamber Furnaces for Glass Melting & Processing; Specialised (1500oC) Glass Rolling Furnace; High and Low temperature ovens; L-shaped glove box system for batching, melting, annealing and casting of glass under dry nitrogen atmosphere (<1ppm); Testometric Precision Glass Extrusion equipment; Hydraulic Glass Extrusion equipment; Fibre Characterisation Laboratory; Access to a variety of analytical equipment, including: SEM facilities; Optical Microscope Facilities, Thermogravimetric and Thermomechanical analyzers."^^xsd:string
→ skos:notation → "F10008"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Our Soft Glass facilities offer a wide range of specialized glass making and fibre drawing equipment including: [nl]
A 5m Fibre Drawing Tower with cane and fibre drawing capabilities up to 1100oC; High Temperature (1700oC & 1800oC) Elevator Hearth Furnaces and High Temperature (1200oC)Chamber Furnaces for Glass Melting & Processing; Specialised (1500oC) Glass Rolling Furnace; High and Low temperature ovens; L-shaped glove box system for batching, melting, annealing and casting of glass under dry nitrogen atmosphere (<1ppm); Testometric Precision Glass Extrusion equipment; Hydraulic Glass Extrusion equipment; Fibre Characterisation Laboratory; Access to a variety of analytical equipment, including: SEM facilities; Optical Microscope Facilities, Thermogravimetric and Thermomechanical analyzers."^^xsd:string
→ dc:description → "Our Soft Glass facilities offer a wide range of specialized glass making and fibre drawing equipment including: [nl]
A 5m Fibre Drawing Tower with cane and fibre drawing capabilities up to 1100oC; High Temperature (1700oC & 1800oC) Elevator Hearth Furnaces and High Temperature (1200oC)Chamber Furnaces for Glass Melting & Processing; Specialised (1500oC) Glass Rolling Furnace; High and Low temperature ovens; L-shaped glove box system for batching, melting, annealing and casting of glass under dry nitrogen atmosphere (<1ppm); Testometric Precision Glass Extrusion equipment; Hydraulic Glass Extrusion equipment; Fibre Characterisation Laboratory; Access to a variety of analytical equipment, including: SEM facilities; Optical Microscope Facilities, Thermogravimetric and Thermomechanical analyzers."^^xsd:string
→ rdfs:label → "ECS - Characterisation (Measurement)"^^xsd:string
→ dcterms:description → "The clean room provides a range of characterisation equipment for device and material characterisation. Plan view imaging of a sample surface can be performed using field emission scanning electron microscopy (FESEM), helium ion microscopy and scanning probe microscopy. Cross-section imaging can be achieved by first making a cross-sectional cut using the focussed ion beam (FIB) system and then imaging in-situ using field emission scanning electron microscopy."^^xsd:string
→ skos:notation → "F10015"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The clean room provides a range of characterisation equipment for device and material characterisation. Plan view imaging of a sample surface can be performed using field emission scanning electron microscopy (FESEM), helium ion microscopy and scanning probe microscopy. Cross-section imaging can be achieved by first making a cross-sectional cut using the focussed ion beam (FIB) system and then imaging in-situ using field emission scanning electron microscopy."^^xsd:string
→ dc:description → "The clean room provides a range of characterisation equipment for device and material characterisation. Plan view imaging of a sample surface can be performed using field emission scanning electron microscopy (FESEM), helium ion microscopy and scanning probe microscopy. Cross-section imaging can be achieved by first making a cross-sectional cut using the focussed ion beam (FIB) system and then imaging in-situ using field emission scanning electron microscopy."^^xsd:string
→ rdfs:label → "53 / 2083"^^xsd:string,
"Room 2083, Building 53"^^xsd:string
→ rdfs:label → "53 / 3023"^^xsd:string,
"Room 3023, Building 53"^^xsd:string
→ rdfs:label → "53 / 4020"^^xsd:string,
"Room 4020, Building 53"^^xsd:string
→ rdfs:label → "Building 53 / Level 2"^^xsd:string,
"Floor 2, Building 53"^^xsd:string
→ rdfs:label → "Building 53 / Level 3"^^xsd:string,
"Floor 3, Building 53"^^xsd:string
→ rdfs:label → "Building 53 / Level 4"^^xsd:string,
"Floor 4, Building 53"^^xsd:string
→ skos:notation → "53-4016"^^http://id.southampton.ac.uk/ns/room-code-scheme
→ rdfs:label → "Refurbished prober S12K with eVUE and thermal refurbished unit"^^xsd:string
→ dcterms:description → "Refurbished prober S12K with eVUE and thermal refurbished unit"^^xsd:string
→ skos:notation → "E11381"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "Refurbished prober S12K with eVUE and thermal refurbished unit"^^xsd:string
→ dc:description → "Refurbished prober S12K with eVUE and thermal refurbished unit"^^xsd:string
→ skos:notation → "53-2022"^^http://id.southampton.ac.uk/ns/room-code-scheme
→ skos:notation → "53-2044"^^http://id.southampton.ac.uk/ns/room-code-scheme
→ rdfs:label → "Supporting Parents Working at the University- Parent Workshop"^^xsd:string
→ dcterms:description → "<p>Join the Faculty of Environmental and Life Sciences and Mentor Mums for an afternoon workshop for parents straddling work and university life.<br /></p><p>Share your experience as a working parent, explore discussions on topics such as rebuilding confidence, goal setting and network with other parents at the University of Southampton.<br /></p>"^^http://purl.org/xtypes/Fragment-XHTML
