→ rdfs:label → "Opt System 100 Metal Etcher"^^xsd:string
→ dcterms:description → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the materials etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon."^^xsd:string
→ skos:notation → "E10240"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
→ rdfs:comment → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the materials etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon."^^xsd:string
→ dc:description → "The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the materials etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon."^^xsd:string
← is
foaf:depicts of
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→ rdfs:label → "University of Southampton"^^xsd:string
→ rdfs:label → "School of Electronics & Computer Science"^^xsd:string
→ rdfs:label → "Physical Sciences and Engineering"^^xsd:string
→ rdfs:label → "Clean Rooms - Nanofabrication"^^xsd:string