http://id.southampton.ac.uk/equipment/E10244

→ rdfs:label → "EVG620 Top Side Mask Aligner"^^xsd:string

→ dcterms:description → "The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm.␣␣Exposure can be performed in hard, soft and proximity modes."^^xsd:string

→ skos:notation → "E10244"^^http://id.southampton.ac.uk/ns/equipment-code-scheme

→ http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within → http://id.southampton.ac.uk/building/53

→ rdfs:comment → "The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm.␣␣Exposure can be performed in hard, soft and proximity modes."^^xsd:string

→ oo:contact → http://id.southampton.ac.uk/equipment/E10244#secondary_contact

→ foaf:page → http://www.southampton-nanofab.com/fabrication/lithography.php

→ dc:description → "The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm.␣␣Exposure can be performed in hard, soft and proximity modes."^^xsd:string

→ oo:formalOrganization → http://id.southampton.ac.uk/

→ oo:organizationPart → http://id.southampton.ac.uk/org/FP, http://id.southampton.ac.uk/org/F7

→ oo:primaryContact → http://id.southampton.ac.uk/equipment/E10244#primary_contact