EVG620 Double Side Mask Aligner
The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.
E10245
The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.
The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.
New Mountbatten
University of Southampton
School of Electronics & Computer Science
Physical Sciences and Engineering
LESSEY, MARK
Clean Rooms - Nanofabrication