http://id.southampton.ac.uk/facility/F10010
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rdfs:label "Clean Rooms - Integrated Photonics"^^xsd:string
dcterms:description "The Integrated Photonics Cleanroom is a 200m? Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
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rdfs:comment "The Integrated Photonics Cleanroom is a 200m? Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
dc:description "The Integrated Photonics Cleanroom is a 200m? Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing."^^xsd:string
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http://id.southampton.ac.uk/building/53
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http://id.southampton.ac.uk/org/EH
rdf:type http://www.w3.org/ns/org#OrganizationalUnit, http://www.w3.org/ns/org#Organization
rdfs:label "Optoelectronics Research Centre"^^xsd:string
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http://id.southampton.ac.uk/facility/F10010#primary_contact
rdf:type foaf:Agent
foaf:phone tel:+442380592960
foaf:name "SESSIONS, NEIL"^^xsd:string
is oo:primaryContact of http://id.southampton.ac.uk/facility/F10010
 
http://id.southampton.ac.uk/equipment/E10305
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Auto 500 Electron Beam Deposition System"^^xsd:string
dcterms:description "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
skos:notation "E10305"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10305#secondary_contact
dc:description "BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10305#primary_contact
 
http://id.southampton.ac.uk/equipment/E10316
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "600C Environmental Oven"^^xsd:string
skos:notation "E10316"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10316#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10316#primary_contact
 
http://id.southampton.ac.uk/equipment/E10319
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "P-16+ Stylus Surface Profiler"^^xsd:string
dcterms:description "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
skos:notation "E10319"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10319#secondary_contact
dc:description "The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10319#primary_contact
 
http://id.southampton.ac.uk/equipment/E10320
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "KLA Tencor Alpha Step IQ Stylus Profier"^^xsd:string
dcterms:description "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8? (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
skos:notation "E10320"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8? (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10320#secondary_contact
dc:description "The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8? (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes."^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10320#primary_contact
 
http://id.southampton.ac.uk/equipment/E10321
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "MRF High Temperature Vacuum Furnace"^^xsd:string
dcterms:description "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen.[cr][nl]
"^^xsd:string
skos:notation "E10321"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen.[cr][nl]
"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10321#secondary_contact
dc:description "This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen.[cr][nl]
"^^xsd:string
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http://id.southampton.ac.uk/equipment/E10322
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Plasmalab 80 Plus / Compact Modular Plasma System"^^xsd:string
dcterms:description "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
skos:notation "E10322"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
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rdfs:comment "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10322#secondary_contact
foaf:page http://www.orc.soton.ac.uk/integratedcleanroom.html
dc:description "Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2."^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/GN
oo:primaryContact http://id.southampton.ac.uk/equipment/E10322#primary_contact
 
http://id.southampton.ac.uk/equipment/E10323
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Plasmalab System 400 / Magnetron Sputtering System"^^xsd:string
dcterms:description "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films. [nl]
[nl]
"^^xsd:string
skos:notation "E10323"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films. [nl]
[nl]
"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10323#secondary_contact
foaf:page http://www.orc.soton.ac.uk/integratedcleanroom.html
dc:description "Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films. [nl]
[nl]
"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10323#primary_contact
 
http://id.southampton.ac.uk/equipment/E10324
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "GX Custom FT-IR Spectrometer (obsolete 1718)"^^xsd:string
dcterms:description "The Frontier? IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity."^^xsd:string
skos:notation "E10324"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/20
rdfs:comment "The Frontier? IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity."^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10324#secondary_contact
dc:description "The Frontier? IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity."^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10324#primary_contact
 
http://id.southampton.ac.uk/equipment/E10329
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "MA6 Mask Aligner"^^xsd:string
dcterms:description "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer [nl]
[nl]
"^^xsd:string
skos:notation "E10329"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer [nl]
[nl]
"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10329#secondary_contact
foaf:page http://www.orc.soton.ac.uk/integratedcleanroom.html
dc:description "Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer [nl]
[nl]
"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10329#primary_contact
 
http://id.southampton.ac.uk/equipment/E10332
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Ionfab 300 Plus / Load Locked Ion Beam Etch System"^^xsd:string
dcterms:description "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
skos:notation "E10332"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10332#secondary_contact
foaf:page http://www.orc.soton.ac.uk/integratedcleanroom.html
dc:description "Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10332#primary_contact
 
http://id.southampton.ac.uk/equipment/E10348
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Planar Air Bearing System"^^xsd:string
dcterms:description "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
skos:notation "E10348"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E10348#secondary_contact
dc:description "Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading."^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10348#primary_contact
 
http://id.southampton.ac.uk/equipment/E10362
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "MJB4 Mask Aligner"^^xsd:string
skos:notation "E10362"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10362#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10362#primary_contact
 
http://id.southampton.ac.uk/equipment/E10373
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Three Zone, Bench Top 1700C Tube Furnace"^^xsd:string
skos:notation "E10373"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10373#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10373#primary_contact
 
http://id.southampton.ac.uk/equipment/E10387
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Nanolink DPN 5000 System"^^xsd:string
skos:notation "E10387"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10387#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E10387#primary_contact
 
http://id.southampton.ac.uk/equipment/E10388
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "ZeMetrics ZeScope Optical Profiling System"^^xsd:string
skos:notation "E10388"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10388#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/~~
oo:primaryContact http://id.southampton.ac.uk/equipment/E10388#primary_contact
 
http://id.southampton.ac.uk/equipment/E10494
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Nano 38 Sputting Machine Lesker Sputter System"^^xsd:string
skos:notation "E10494"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10494#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/WF, http://id.southampton.ac.uk/org/F7
oo:primaryContact http://id.southampton.ac.uk/equipment/E10494#primary_contact
 
http://id.southampton.ac.uk/equipment/E10840
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "PVA Tepla 300 Plasma System"^^xsd:string
skos:notation "E10840"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
oo:contact http://id.southampton.ac.uk/equipment/E10840#secondary_contact
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/FP, http://id.southampton.ac.uk/org/F7
oo:primaryContact http://id.southampton.ac.uk/equipment/E10840#primary_contact
 
http://id.southampton.ac.uk/equipment/E11272
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Flame Hydrolysis Deposition Chamber - 1 of 2"^^xsd:string
dcterms:description "Flame Hydrolysis Deposition Chamber"^^xsd:string
skos:notation "E11272"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Flame Hydrolysis Deposition Chamber"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E11272#secondary_contact
dc:description "Flame Hydrolysis Deposition Chamber"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E11272#primary_contact
 
http://id.southampton.ac.uk/equipment/E11273
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
dcterms:description "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
skos:notation "E11273"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E11273#secondary_contact
dc:description "Flame Hydrolysis Deposition Chamber - 2 of 2"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E11273#primary_contact
 
http://id.southampton.ac.uk/equipment/E11274
oo:relatedFacility http://id.southampton.ac.uk/facility/F10010
rdf:type oo:Equipment
rdfs:label "Vertical Furnace"^^xsd:string
dcterms:description "Vertical Furnace"^^xsd:string
skos:notation "E11274"^^http://id.southampton.ac.uk/ns/equipment-code-scheme
http://data.ordnancesurvey.co.uk/ontology/spatialrelations/within http://id.southampton.ac.uk/building/53
rdfs:comment "Vertical Furnace"^^xsd:string
oo:contact http://id.southampton.ac.uk/equipment/E11274#secondary_contact
dc:description "Vertical Furnace"^^xsd:string
oo:formalOrganization http://id.southampton.ac.uk/
oo:organizationPart http://id.southampton.ac.uk/org/F7, http://id.southampton.ac.uk/org/EH
oo:primaryContact http://id.southampton.ac.uk/equipment/E11274#primary_contact