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EVG620 Top Side Mask Aligner

The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm. Exposure can be performed in hard, soft and proximity modes.

Facility:: Clean Rooms - Nanofabrication
Part of:: School of Electronics & Computer Science
Physical Sciences and Engineering
Location:: New Mountbatten

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LESSEY, MARK

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