Evg620 Double Side Mask Aligner
The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.
| Facility: | Clean Rooms - Nanofabrication |
| Part of: | School of Electronics & Computer Science Physical Sciences and Engineering |
| Location: | New Mountbatten |
Contact
LESSEY, MARK
If you have additions or corrections to a facility or equipment entry please contact your Faculty Finance Team.
Get the Data
If you're that way inclined, you can get the raw data used to create this page in various formats, as listed below.
| TTL | RDF/Turtle file |
| RDF | RDF/XML file |
| RDF.HTML | HTML visualisation of raw data |
The following open datasets were used to build this page:
| Facilities and Equipment |
| Photographs of University of Southampton Things |