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5430 Fine Wire Bonder SN 30280

Photograph of 5430 Fine Wire Bonder SN 30280 at the University of Southampton (thumbnail).

Ultrasonic wedge bonder, AI and Au wires (25um), minimum bond pads 50x50um2, bare silicon bonding, programmable individual bonding parameters.

Facility:: Clean Rooms - Nanofabrication
Part of:: School of Electronics & Computer Science
Physical Sciences and Engineering
Location:: New Mountbatten

Contact

LESSEY, MARK

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