5430 Fine Wire Bonder SN 30280
Ultrasonic wedge bonder, AI and Au wires (25um), minimum bond pads 50x50um2, bare silicon bonding, programmable individual bonding parameters.
| Facility: | Clean Rooms - Nanofabrication |
| Part of: | School of Electronics & Computer Science Physical Sciences and Engineering |
| Location: | New Mountbatten |
Contact
LESSEY, MARK
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