Measures roughness, waviness, step height and wafer stress, 2D and 3D fully autiomated data scans, sequencing capable, up to 8" substrates, vertical features from 100A-300um with a vertical resolution down to 0.5A.
LESSEY, MARK
You can download the raw data used to create this page:
The following open datasets were used to build this page:
© 2025 University of Southampton