EVG620 Double Side Mask Aligner

EVG620 Double Side Mask Aligner Photo

The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers.

Facility:

Clean Rooms - Nanofabrication

Part of:

School of Electronics & Computer Science
Physical Sciences and Engineering

Location:

New Mountbatten

Contact

LESSEY, MARK