Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films.
SESSIONS, NEIL
You can download the raw data used to create this page:
The following open datasets were used to build this page:
© 2025 University of Southampton