Plasmalab System 400 / Magnetron Sputtering System
Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films.
| Facility: | Clean Rooms - Integrated Photonics |
| Part of: | Physical Sciences and Engineering Optoelectronics Research Centre |
| Location: | New Mountbatten |
Contact
SESSIONS, NEIL
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