MA6 Mask Aligner
Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer
Facility: | Clean Rooms - Integrated Photonics |
Part of: | Physical Sciences and Engineering Optoelectronics Research Centre |
Location: | New Mountbatten |
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SESSIONS, NEIL
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