Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer

Facility:

Clean Rooms - Integrated Photonics

Part of:

Physical Sciences and Engineering
Optoelectronics Research Centre

Location:

New Mountbatten

Contact

SESSIONS, NEIL